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1. (WO2018221277) METHOD FOR MANUFACTURING CARRIER TAPE FOR ELECTRONIC COMPONENTS

Pub. No.:    WO/2018/221277    International Application No.:    PCT/JP2018/019381
Publication Date: Fri Dec 07 00:59:59 CET 2018 International Filing Date: Sat May 19 01:59:59 CEST 2018
IPC: B65B 15/04
B29C 59/02
B65D 85/86
Applicants: SHIN-ETSU POLYMER CO., LTD.
信越ポリマー株式会社
Inventors: AIZAWA Junichi
相沢 純一
Title: METHOD FOR MANUFACTURING CARRIER TAPE FOR ELECTRONIC COMPONENTS
Abstract:
Provided is a method for manufacturing a carrier tape for electronic components, said method making it possible to effectively eliminate the risk of damage to projecting parts of semiconductor packages or other electronic components. This manufacturing method involves: holding a softened resin sheet between an upper die 2 and a lower die 3 of a mold; hot-press molding a bottomed, low-profile rectangular-tube-shaped accommodating emboss that accommodates a semiconductor package; and forming a position-restricting projection spanned by the lead frame of the semiconductor package between a bottom plate of the accommodating emboss and a raised-bottom seat plate. In the lower die 3, a molding rib 30 for the position-restricting projection is formed so as to project in a tapering manner, and a distal-end part 31 thereof is curved into a rounded shape, thereby reducing the wall thickness of the distal-end part of the position-restricting projection and minimizing the width of the position-restricting projection. Because the width of the position-restricting projection can be reduced to a narrow form, it is possible to eliminate the risk that the lead frame will be easily deformed and damaged due to pressure contact between the position-restricting projection of the accommodating emboss and the lower part of the lead frame of the semiconductor package.