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1. (WO2018221273) HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
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Pub. No.: WO/2018/221273 International Application No.: PCT/JP2018/019336
Publication Date: 06.12.2018 International Filing Date: 18.05.2018
IPC:
H04B 1/50 (2006.01) ,H01L 23/00 (2006.01) ,H01L 23/12 (2006.01) ,H01L 23/28 (2006.01) ,H05K 1/02 (2006.01) ,H05K 9/00 (2006.01)
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
B
TRANSMISSION
1
Details of transmission systems, not covered by a single one of groups H04B3/-H04B13/123; Details of transmission systems not characterised by the medium used for transmission
38
Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
40
Circuits
50
using different frequencies for the two directions of communication
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
9
Screening of apparatus or components against electric or magnetic fields
Applicants:
株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP/JP]; 京都府長岡京市東神足1丁目10番1号 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors:
中川 大 NAKAGAWA, Dai; JP
Agent:
吉川 修一 YOSHIKAWA, Shuichi; JP
傍島 正朗 SOBAJIMA, Masaaki; JP
Priority Data:
2017-11036602.06.2017JP
Title (EN) HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
(FR) MODULE HAUTE FRÉQUENCE ET DISPOSITIF DE COMMUNICATION
(JA) 高周波モジュール及び通信装置
Abstract:
(EN) This high frequency module (100) is provided with: a multilayer substrate (110) which comprises a plurality of insulator layers and at least one ground conductor layer (113); a transmission circuit (120) which is a first circuit provided in a first region of the multilayer substrate (110) and an antenna circuit (130) which is a second circuit provided in a second region that is different from the first region; and shield conductor films (151-156) which are provided on the side surfaces of the multilayer substrate (110), and which are in partial contact with the ground conductor layer (113). The ground conductor layer (113) is not in contact with the shield conductor films (151-156) in a portion of the side surfaces of the multilayer substrate (110), said portion being closest to both the first region and the second region.
(FR) Le module haute fréquence (100) de la présente invention comprend : un substrat multicouche (110) qui comprend une pluralité de couches isolantes et au moins une couche conductrice de masse (113) ; un circuit de transmission (120) qui est un premier circuit disposé dans une première région du substrat multicouche (110) et un circuit d'antenne (130) qui est un second circuit disposé dans une seconde région différente de la première région ; et des films conducteurs de blindage (151-156) qui sont disposés sur les surfaces latérales du substrat multicouche (110) et qui sont en contact partiel avec la couche conductrice de masse (113). La couche conductrice de masse (113) n'est pas en contact avec les films conducteurs de blindage (151-156) dans une partie des surfaces latérales du substrat multicouche (110), ladite partie étant plus proche à la fois de la première région et de la seconde région.
(JA) 高周波モジュール(100)は、複数の絶縁体層と少なくとも1つのグランド導体層(113)とを含む多層基板(110)と、多層基板(110)の第1領域に設けられた第1回路である送信回路(120)および第1領域と異なる第2領域に設けられた第2回路であるアンテナ回路(130)と、多層基板(110)の側面に設けられ、グランド導体層(113)と部分的に接触しているシールド導体膜(151~156)と、を備え、グランド導体層(113)は、多層基板(110)の側面の第1領域と第2領域との双方に最近接する部分においてシールド導体膜(151~156)と接触していない。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)