Search International and National Patent Collections

1. (WO2018221251) MOISTURE-CURABLE HOT-MELT ADHESIVE AGENT

Pub. No.:    WO/2018/221251    International Application No.:    PCT/JP2018/019151
Publication Date: Fri Dec 07 00:59:59 CET 2018 International Filing Date: Fri May 18 01:59:59 CEST 2018
IPC: C08G 18/48
C08G 18/76
C08G 18/10
C08G 18/12
C08G 18/40
C08G 18/42
C09J 175/06
C09J 193/04
Applicants: HENKEL AG & CO. KGAA
Inventors: MATSUDA, Kenji
TAKAMORI, Ai
HAYAKAWA, Tadashi
Title: MOISTURE-CURABLE HOT-MELT ADHESIVE AGENT
Abstract:
To provide a moisture-curable hot-melt adhesive agent having excellent balance of initial adhesive strength, adhesive strength after curing and heat resistance and the like, and a layered product bonded with the moisture-curable hot-melt adhesive agent. Means for solving the problem: A moisture-curable hot-melt adhesive agent comprising an urethane prepolymer having an isocyanate group at the end (A), a styrene-isoprene based block copolymer (B), and a tackifying resin (C), wherein the moisture-curable hot-melt adhesive agent comprises 25 to 64% by weight of (A), based on 100 parts by weight in total of (A) and (B).