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1. (WO2018221250) MOISTURE-CURABLE HOT-MELT ADHESIVE AGENT

Pub. No.:    WO/2018/221250    International Application No.:    PCT/JP2018/019147
Publication Date: Fri Dec 07 00:59:59 CET 2018 International Filing Date: Fri May 18 01:59:59 CEST 2018
IPC: C08G 18/76
C08G 18/40
C08G 18/42
C09J 175/04
C09J 175/06
C08G 18/10
C08G 18/12
Applicants: HENKEL AG & CO. KGAA
Inventors: MATSUDA, Kenji
TAKAMORI, Ai
HAYAKAWA, Tadashi
Title: MOISTURE-CURABLE HOT-MELT ADHESIVE AGENT
Abstract:
To provide a moisture-curable hot-melt adhesive agent having excellent balance of initial adhesive strength, adhesive strength after curing and heat resistance and the like, and a layered product bonded with the moisture-curable hot-melt adhesive agent. Means for solving the problem: A moisture-curable hot-melt adhesive agent comprising an urethane prepolymer having an isocyanate group at the end (A), a styrene based block copolymer (B), and a tackifying resin (C), wherein the styrene based block copolymer (B) comprises a styrene based block copolymer having 10 to 35% by weight of a styrene content (B1) and a styrene based block copolymer having 40 to 70% by weight of a styrene content (B2).