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1. (WO2018221227) COPPER COLLOIDAL CATALYST LIQUID FOR ELECTROLESS COPPER PLATING, ELECTROLESS COPPER PLATING METHOD, AND PRODUCTION METHOD FOR COPPER-PLATED SUBSTRATE

Pub. No.:    WO/2018/221227    International Application No.:    PCT/JP2018/018972
Publication Date: Fri Dec 07 00:59:59 CET 2018 International Filing Date: Thu May 17 01:59:59 CEST 2018
IPC: C23C 18/18
Applicants: ISHIHARA CHEMICAL CO., LTD.
石原ケミカル株式会社
Inventors: KIMURA, Yusuke
木村 祐介
YOSHIZAWA, Akihiro
吉澤 章央
UCHIDA, Ei
内田 衛
TANAKA, Kaoru
田中 薫
Title: COPPER COLLOIDAL CATALYST LIQUID FOR ELECTROLESS COPPER PLATING, ELECTROLESS COPPER PLATING METHOD, AND PRODUCTION METHOD FOR COPPER-PLATED SUBSTRATE
Abstract:
According to the present invention, the temporal stability and the sustainability of catalyst activity of a catalyst liquid are both significantly improved since electroless copper plating is performed by subjecting a non-conductive substrate to an adsorption acceleration treatment (pretreatment) by bringing the non-conductive substrate into contact with a surfactant-containing liquid, and by applying a catalyst to the non-conductive substrate using a copper colloidal catalyst liquid that is for electroless copper plating and that contains (A) a soluble copper salt, (B) a reducing agent, (C) a colloidal stabilizer, and (D) a non-reducing oligosaccharide such as sucrose and trehalose. In addition, a deposited copper coating membrane will have excellent appearance since electroless copper plating is performed by applying a catalyst after the catalyst activity thereof is enhanced by the adsorption acceleration treatment (pretreatment).