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1. (WO2018221183) METHOD FOR MANUFACTURING TRANSPARENT ELECTROCONDUCTIVE SUBSTRATE, AND TRANSPARENT ELECTROCONDUCTIVE SUBSTRATE

Pub. No.:    WO/2018/221183    International Application No.:    PCT/JP2018/018559
Publication Date: Fri Dec 07 00:59:59 CET 2018 International Filing Date: Tue May 15 01:59:59 CEST 2018
IPC: G06F 3/041
B32B 7/02
B32B 15/08
G06F 3/044
Applicants: SUMITOMO METAL MINING CO., LTD.
住友金属鉱山株式会社
Inventors: SHIMOJI, Takumi
下地 匠
Title: METHOD FOR MANUFACTURING TRANSPARENT ELECTROCONDUCTIVE SUBSTRATE, AND TRANSPARENT ELECTROCONDUCTIVE SUBSTRATE
Abstract:
Provided is a method for manufacturing a transparent electroconductive substrate having a patterning process for patterning a laminate which is a constituent of a laminated substrate that includes a transparent substrate and the laminate arranged on at least one side of the transparent substrate and consisting of a first blackening layer containing nickel and copper and an electroconductive layer containing copper that are laminated in the order stated from the transparent substrate side, the patterning process having an electroconductive layer etching step for etching the electroconductive layer with a first etchant with which copper can be dissolved, and a first blackening layer etching step for etching the first blackening layer with a second etchant containing chloride icons and water, the chloride ion concentration of the second etchant being 10 mass% or more in terms of hydrochloric acid.