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1. (WO2018221089) PCB TERMINAL PRODUCTION METHOD AND PCB TERMINAL

Pub. No.:    WO/2018/221089    International Application No.:    PCT/JP2018/016714
Publication Date: Fri Dec 07 00:59:59 CET 2018 International Filing Date: Thu Apr 26 01:59:59 CEST 2018
IPC: H01R 43/16
C25D 5/02
C25D 5/12
C25D 7/00
H01R 13/03
Applicants: ORIENTAL ELECTRO PLATING CORPORATION
オリエンタル鍍金株式会社
Inventors: TAKAHASHI Hiroyoshi
高橋 宏▲禎▼
Title: PCB TERMINAL PRODUCTION METHOD AND PCB TERMINAL
Abstract:
The purpose of the present invention is to provide: a PCB terminal that has excellent abrasion resistance properties, electrical conductivity, slidability, and low frictional properties, and that enables reduction in the usage amount of gold, which is expensive; and a production method therefor. This method is for producing a comb-like PCB terminal having a plurality of male terminals of a substantially square pillar shape, and is characterized by comprising: a first step for applying nickel plating on a metal substrate formed in the shape of the PCB terminal, and forming a nickel plating layer across the entire surface of the male terminals; a second step for applying a masking treatment to the front surface and the rear surface of the male terminals so as to form a masking layer thereon; a third step for, after applying the entire surface of the male terminals with a resist, removing the masking layer and curing the resist so as to form a resist layer on both lateral surfaces of the male terminals; and a fourth step for performing a gold plating treatment on the male terminals to form a gold plated layer on the front and rear surfaces of the male terminals, and then removing the resist layer.