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1. (WO2018220989) SPUTTERING TARGET

Pub. No.:    WO/2018/220989    International Application No.:    PCT/JP2018/013739
Publication Date: Fri Dec 07 00:59:59 CET 2018 International Filing Date: Sat Mar 31 01:59:59 CEST 2018
IPC: C23C 14/34
B22F 5/00
C22C 23/06
C22C 28/00
Applicants: MITSUI MINING & SMELTING CO., LTD.
三井金属鉱業株式会社
Inventors: TAKEYA, Syunsuke
竹谷 俊亮
Title: SPUTTERING TARGET
Abstract:
The present invention pertains to a sputtering target containing Y and Mg and having a composition represented by (1-x)Mg-xY (where, 0