Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2018220958) LIGHT-RECEIVING MODULE FOR ENCODER, AND ENCODER
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/220958 International Application No.: PCT/JP2018/011376
Publication Date: 06.12.2018 International Filing Date: 22.03.2018
IPC:
G01D 5/347 (2006.01) ,H01L 31/02 (2006.01) ,H01L 31/0232 (2014.01)
G PHYSICS
01
MEASURING; TESTING
D
MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED BY A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; TRANSFERRING OR TRANSDUCING ARRANGEMENTS NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
5
Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
26
using optical means, i.e. using infra-red, visible or ultra-violet light
32
with attenuation or whole or partial obturation of beams of light
34
the beams of light being detected by photocells
347
using displacement encoding scales
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
Details
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
Details
0232
Optical elements or arrangements associated with the device
Applicants:
浜松ホトニクス株式会社 HAMAMATSU PHOTONICS K.K. [JP/JP]; 静岡県浜松市東区市野町1126番地の1 1126-1, Ichino-cho, Higashi-ku, Hamamatsu-shi, Shizuoka 4358558, JP
Inventors:
鈴木 貴幸 SUZUKI Takayuki; JP
辻 勇治 TSUJI Yuji; JP
Agent:
長谷川 芳樹 HASEGAWA Yoshiki; JP
黒木 義樹 KUROKI Yoshiki; JP
柴山 健一 SHIBAYAMA Kenichi; JP
Priority Data:
2017-10786331.05.2017JP
Title (EN) LIGHT-RECEIVING MODULE FOR ENCODER, AND ENCODER
(FR) MODULE DE RÉCEPTION DE LUMIÈRE POUR CODEUR ET CODEUR
(JA) エンコーダ用受光モジュール及びエンコーダ
Abstract:
(EN) A light-receiving module 6 is provided with: a support body 11 having a bottom wall part 16 and a side wall part 17; a light-receiving element 12 disposed on the bottom wall part 16 so that a light-receiving surface 21a faces toward one side S, the light-receiving element 12 being surrounded by the side wall part 17 when viewed from the one side S; and a fiber optic plate 13 having an input surface 13a formed by one-end surfaces of a plurality of optical fibers and an output surface 13b formed by the other end surfaces of the plurality of optical fibers, the fiber optic plate 13 being disposed on the light-receiving element 12 so that the output surface 13b faces the light-receiving surface 21a. An end surface 17b of the side wall part 17 on the one side S is positioned further toward the one side S than the light-receiving surface 21a, and the input surface 13a is positioned further toward the one side S than the end surface 17b.
(FR) L'invention concerne un module de réception de lumière 6 étant pourvu : d'un corps de support 11 ayant une partie de paroi inférieure 16 et une partie de paroi latérale 17 ; un élément de réception de lumière 12 disposé sur la partie de paroi inférieure 16 de telle sorte qu'une surface de réception de lumière 21a soit tournée vers un côté S, l'élément de réception de lumière 12 étant entouré par la partie de paroi latérale 17 lorsqu'il est vu depuis le côté S ; et une plaque de fibre optique 13 ayant une surface d'entrée 13a formée par des surfaces d'extrémité d'une pluralité de fibres optiques et une surface de sortie 13b formée par les autres surfaces d'extrémité de la pluralité de fibres optiques, la plaque de fibre optique 13 étant disposée sur l'élément de réception de lumière 12 de telle sorte que la surface de sortie 13b fasse face à la surface de réception de lumière 21a. Une surface d'extrémité 17b de la partie de paroi latérale 17 sur le côté S est positionnée davantage vers le côté S que la surface de réception de lumière 21a, et la surface d'entrée 13a est positionnée davantage vers le côté S que la surface d'extrémité 17b.
(JA) 受光モジュール6は、底壁部16及び側壁部17を有する支持体11と、受光面21aが一方側Sを向くように底壁部16上に配置され、一方側Sから見た場合に側壁部17によって包囲された受光素子12と、複数の光ファイバの一端面により構成された入力面13a、及び、複数の光ファイバの他端面により構成された出力面13bを有し、出力面13bが受光面21aと向かい合うように受光素子12上に配置されたファイバオプティックプレート13と、を備える。側壁部17における一方側Sの端面17bは、受光面21aよりも一方側Sに位置しており、入力面13aは、端面17bよりも一方側Sに位置している。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)