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1. (WO2018220934) EPOXY RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Pub. No.:    WO/2018/220934    International Application No.:    PCT/JP2018/009082
Publication Date: Fri Dec 07 00:59:59 CET 2018 International Filing Date: Fri Mar 09 00:59:59 CET 2018
IPC: C08G 59/00
C08L 63/00
H01L 21/56
H01L 23/29
H01L 23/31
H01L 31/02
H01L 33/56
H01L 33/60
Applicants: KYOCERA CORPORATION
京セラ株式会社
Inventors: OKAMOTO Massanori
岡本 正法
Title: EPOXY RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Abstract:
Provided are: an epoxy resin composition that has exceptional releaseability during continuous molding and exceptional soldering heat resistance (product adhesion), and that undergoes little discoloration when left at high temperatures; and a semiconductor device in which the epoxy resin composition is used. The epoxy resin composition contains as essential components, (A) an epoxy resin, (B) a curing agent, (C) a curing promoter, (D) a phenolic antioxidant having a melting point of 150°C or less, (E) an antioxidant having a melting point of 150°C or less and a sulfur atom in the backbone thereof, and (F) a polyether group-containing compound. An optical semiconductor device 11 has a base 12, a semiconductor element 13 that is fixed to the base 12, and a sealing resin 14 in which the semiconductor element 13 is sealed and which is a cured object of a transparent epoxy resin composition.