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1. (WO2018220868) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
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Pub. No.: WO/2018/220868 International Application No.: PCT/JP2017/028390
Publication Date: 06.12.2018 International Filing Date: 04.08.2017
IPC:
H01L 21/56 (2006.01) ,H01L 21/60 (2006.01) ,H01L 23/12 (2006.01)
[IPC code unknown for H01L 21/56][IPC code unknown for H01L 21/60][IPC code unknown for H01L 23/12]
Applicants:
アオイ電子株式会社 AOI ELECTRONICS CO., LTD. [JP/JP]; 香川県高松市香西南町455番地の1 455-1, Kohzai-Minamimachi, Takamatsu-shi, Kagawa 7618014, JP
Inventors:
高尾 勝大 TAKAO, Katsuhiro; JP
Agent:
永井 冬紀 NAGAI, Fuyuki; JP
池田 恵一 IKEDA, Keiichi; JP
Priority Data:
2017-10660830.05.2017JP
Title (EN) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
(FR) DISPOSITIF À SEMICONDUCTEUR ET PROCÉDÉ DE FABRICATION D'UN DISPOSITIF À SEMICONDUCTEUR
(JA) 半導体装置および半導体装置の製造方法
Abstract:
(EN) A semiconductor device comprising a semiconductor element having a plated part on a portion of a bottom surface, and a protective member for sealing the surface other than the bottom surface of the semiconductor element, the plated part being electrically connected to a circuit within the semiconductor element.
(FR) L'invention concerne un dispositif à semi-conducteur comprenant un élément semi-conducteur ayant une partie plaquée sur une partie d'une surface inférieure, et un élément de protection pour sceller la surface autre que la surface inférieure de l'élément semi-conducteur, la partie plaquée étant électroconnectée à un circuit à l'intérieur de l'élément semi-conducteur.
(JA) 半導体装置は、底面の一部にめっき部を有する半導体素子と、前記半導体素子の前記底面以外の面を封止する保護部材とを備え、前記めっき部は、前記半導体素子内の回路と電気的に接続されている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)