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1. (WO2018220846) SEMICONDUCTOR MODULE

Pub. No.:    WO/2018/220846    International Application No.:    PCT/JP2017/020686
Publication Date: Fri Dec 07 00:59:59 CET 2018 International Filing Date: Sat Jun 03 01:59:59 CEST 2017
IPC: G11C 5/04
H01L 25/065
H01L 25/07
H01L 25/16
H01L 25/18
Applicants: ULTRAMEMORY INC.
ウルトラメモリ株式会社
Inventors: TAKISHITA, Ryuji
瀧下 隆治
ADACHI, Takao
安達 隆郎
Title: SEMICONDUCTOR MODULE
Abstract:
The present invention provides a semiconductor module capable of improving a bandwidth between a logic chip and a RAM. According to the present invention, a semiconductor module 1 is provided with: a logic chip; a pair of RAM units 30 each composed of a lamination-type RAM module; a first interposer 10 electrically connected to the logic chip and to each of the pair of RAM units 30; and a connection unit 40 that communicatively connects the logic chip and each of the pair of RAM units 30, wherein one RAM unit 30a is placed on the first interposer 10, and has one end portion disposed so as to overlap, in the lamination direction C, one end portion of the logic chip with the connection unit 40 therebetween, and the other RAM unit 30b is disposed so as to overlap the one RAM unit 30a with the connection unit 40 therebetween, and is also disposed along the outer periphery of the logic chip.