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1. (WO2018220717) ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME

Pub. No.:    WO/2018/220717    International Application No.:    PCT/JP2017/020117
Publication Date: Fri Dec 07 00:59:59 CET 2018 International Filing Date: Wed May 31 01:59:59 CEST 2017
IPC: H05K 3/36
H05K 1/02
H05K 1/14
H05K 3/28
Applicants: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
新電元工業株式会社
Inventors: OKANO Toshifumi
岡野 俊史
Title: ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME
Abstract:
This electronic device comprises: a first printed substrate including a first principal surface and a second principal surface on the side opposite the first principal surface, a first connection land being provided at a side end of the first principal surface, and a reference member being provided on the first connection land; a second printed substrate including a third principal surface and a fourth principal surface on the side opposite the third principal surface, a substrate through-hole that penetrates between the third principal surface and the fourth principal surface being formed at a side end of the fourth principal surface, and a second connection land being provided adjacent to an opening of the substrate through-hole of the fourth principal surface; and a conductive bonding material that electrically connects between the first connection land and the second connection land. The reference member repels the conductive bonding material that has melted upon the bonding of the first printed substrate and the second printed substrate.