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1. (WO2018220674) SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Pub. No.:    WO/2018/220674    International Application No.:    PCT/JP2017/019908
Publication Date: Fri Dec 07 00:59:59 CET 2018 International Filing Date: Tue May 30 01:59:59 CEST 2017
IPC: H01S 5/026
H01S 5/323
Applicants: MITSUBISHI ELECTRIC CORPORATION
三菱電機株式会社
Inventors: KAWASAKI, Kazushige
川▲崎▼ 和重
Title: SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Abstract:
A semiconductor device according to the present invention is provided with: a substrate; a semiconductor laser that is provided on the upper surface of the substrate and emits laser beams; a waveguide having a first conductive layer that is provided on the upper surface of the substrate, and a waveguide layer that is provided on the first conductive layer and guides laser beams; and an embedded layer that is provided on the upper surface of the substrate and encloses the semiconductor laser and the waveguide. On both sides of an end portion of the waveguide connected to the semiconductor laser, exposure parts are provided in which the substrate is exposed from the embedded layer by dividing the embedded layer in the waveguide direction of the waveguide. In the end portion, division areas are provided in which the first conductive layer is divided in the waveguide direction.