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1. (WO2018220661) PACKAGING APPARATUS

Pub. No.:    WO/2018/220661    International Application No.:    PCT/JP2017/019828
Publication Date: Fri Dec 07 00:59:59 CET 2018 International Filing Date: Tue May 30 01:59:59 CEST 2017
IPC: B65D 5/50
B65D 81/113
B65D 85/68
Applicants: MITSUBISHI ELECTRIC CORPORATION
三菱電機株式会社
Inventors: ISSHIKI, Kazunori
一色 和慶
UNNO, Kenichi
海野 賢一
Title: PACKAGING APPARATUS
Abstract:
This packaging apparatus has: at least one bottom buffer material on which the bottom of a body to be packaged is mounted; and a bottom corrugated board material provided with a flat bottom plate part on which said at least one bottom buffer material is mounted. The bottom plate part is provided with at least one pressing member that is formed by being cut and raised from the bottom plate part. Said at least one pressing member has a bending base groove formed at a portion which is to be the base and has an intermediate groove formed in parallel to the base groove at a portion between the leading end and the base of the pressing member. Said at least one bottom buffer material is placed so as to cover a portion of at least one opening which is formed in the bottom plate part due to cutting and raising of the pressing member, the portions being at the side opposite to the bases section of the opening. Said at least one pressing member abuts against the lateral wall of the bottom buffer material and restricts the movement of the bottom buffer material toward the base groove.