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1. (WO2018220417) HEAT SINK STRUCTURE

Pub. No.:    WO/2018/220417    International Application No.:    PCT/IB2017/000837
Publication Date: Fri Dec 07 00:59:59 CET 2018 International Filing Date: Thu Jun 01 01:59:59 CEST 2017
IPC: H01L 23/367
Applicants: AGILE POWER SWITCH 3D INTEGRATION APSI3D
IRT ANTOINE DE SAINT EXUPERY
INSTITUT CATHOLIQUE D'ARTS ET METIERS
Inventors: FAVRE, Jacques Pierre Henri
REYNES, Jean-Michel Francis
FRADIN, Jean-Pierre Bernard Marie
CADILE, Claudia
LACABANNE, Renaud André
Title: HEAT SINK STRUCTURE
Abstract:
A heat sink structure (10) comprises a plurality of heat sink parts (16), each heat sink part having a contact area (12) for contacting a surface of an electronic device. The heat sink parts (16) may be connected but are spaced apart so as to allow them to adjust and keep their contact areas (12) contacting the surface of the electronic device when the surface is distorted, for example due to heating. A heat sink part (16) may comprise at least two spaced apart heat sink elements (11) which may be connected.