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1. (WO2018220039) HOT-MELT PRESSURE SENSITIVE ADHESIVE COMPOSITION HAVING IMPROVED RHEOLOGICAL PROPERTIES

Pub. No.:    WO/2018/220039    International Application No.:    PCT/EP2018/064228
Publication Date: Fri Dec 07 00:59:59 CET 2018 International Filing Date: Thu May 31 01:59:59 CEST 2018
IPC: C09J 153/02
C09J 7/00
C09J 123/00
C09J 123/26
Applicants: SIKA TECHNOLOGY AG
Inventors: UEDING, Daniel
VILA FERREIRA, Juan Ramón
HANHÖRSTER, Thomas
Title: HOT-MELT PRESSURE SENSITIVE ADHESIVE COMPOSITION HAVING IMPROVED RHEOLOGICAL PROPERTIES
Abstract:
The invention is directed to adhesive compositions containing at least one first styrene-isoprene-styrene block copolymer having a diblock content of not less than 45 %, at least one second styrene-isoprene- styrene block copolymer having a styrene content of not more than 30 wt.-%, at least one first tackifying resin having a softening point of equal to or higher than 100 °C, and at least one second tackifying resin having a softening point of equal to or higher than 120 °C. The invention is also directed to a method for bonding substrates together using the adhesive composition.