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1. (WO2018219961) HEAT-CURING EPOXY RESIN ADHESIVES
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Pub. No.: WO/2018/219961 International Application No.: PCT/EP2018/064090
Publication Date: 06.12.2018 International Filing Date: 29.05.2018
IPC:
C08G 59/50 (2006.01) ,C08G 59/62 (2006.01) ,C08G 59/40 (2006.01) ,C08G 59/56 (2006.01) ,C09J 163/00 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40
characterised by the curing agents used
50
Amines
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40
characterised by the curing agents used
62
Alcohols or phenols
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40
characterised by the curing agents used
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40
characterised by the curing agents used
50
Amines
56
together with other curing agents
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
163
Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
Applicants:
SIKA TECHNOLOGY AG [CH/CH]; Zugerstrasse 50 6340 Baar, CH
Inventors:
VOCI, Antonio; CH
GUTGSELL, Michael; CH
EYHOLZER, Christian; CH
Priority Data:
17173288.629.05.2017EP
Title (EN) HEAT-CURING EPOXY RESIN ADHESIVES
(FR) ADHÉSIFS À BASE DE RÉSINE ÉPOXY THERMODURCISSABLES
(DE) HITZEHÄRTENDE EPOXIDHARZKLEBSTOFFE
Abstract:
(EN) The invention relates to heat-curing epoxy resin compositions, which can be used in particular as body-in-white adhesives for vehicle construction. The heat-curing epoxy resin compositions contain a curing agent, which can be activated by elevated temperature, and comprise a first component K1 containing at least one epoxy resin and a second component K2 containing at least one tertiary amine and a primary amine. After brief heating of 30 to 120 seconds to a temperature of 90°C to 130°C, said compositions have sufficient strength and adhesion to withstand mechanical loads arising from transport.
(FR) La présente invention concerne des compositions de résine époxy thermodurcissables, pouvant être utilisées en particulier comme adhésifs de coque de carrosserie en construction automobile. Ces compositions de résine époxy thermodurcissables contiennent un durcisseur activable sous l'effet d'une température élevée et comprennent un premier composant K1 contenant au moins une résine époxy et un deuxième composant K2 contenant au moins une amine tertiaire et une amine primaire. Après un chauffage de courte durée de 30 à 120 secondes à une température comprise entre 90 °C et 130 °C, ces compositions présentent une résistance et une adhérence suffisantes pour supporter des contraintes mécaniques dues au transport.
(DE) Die vorliegende Erfindung betrifft hitzehärtende Epoxidharzzusammensetzungen, welche insbesondere als Rohbauklebstoffe für den Fahrzeugbau verwendet werden können. Die hitzehärtenden Epoxidharzzusammensetzungen enthalten einen durch erhöhte Temperatur aktivierbaren Härter und umfassen eine erste Komponente K1 enthaltend mindestens ein Epoxidharz und eine zweite Komponente K2 enthaltend mindestens ein tertiäres Amin sowie ein primäres Amin. Diese Zusammensetzungen weisen nach kurzzeitiger Erhitzung von 30 bis 120 Sekunden auf eine Temperatur von 90°C bis 130°C eine ausreichende Festigkeit und Haftung auf, um transportbedingten mechanischen Belastungen zu widerstehen.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)