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1. (WO2018219848) COMPOSITION FOR TIN ALLOY ELECTROPLATING COMPRISING LEVELING AGENT
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Pub. No.: WO/2018/219848 International Application No.: PCT/EP2018/063889
Publication Date: 06.12.2018 International Filing Date: 28.05.2018
IPC:
C25D 3/32 (2006.01) ,C25D 3/60 (2006.01)
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
3
Electroplating; Baths therefor
02
from solutions
30
of tin
32
characterised by the organic bath constituents used
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
3
Electroplating; Baths therefor
02
from solutions
56
of alloys
60
containing more than 50% by weight of tin
Applicants:
BASF SE [DE/DE]; Carl-Bosch-Strasse 38 67056 Ludwigshafen am Rhein, DE
Inventors:
FLUEGEL, Alexander; DE
LINDNER, Jean-Pierre Berkan; DE
ARNOLD, Marco; DE
Agent:
BASF IP ASSOCIATION; BASF SE G-FLP - C006 67056 Ludwigshafen, DE
Priority Data:
17173987.301.06.2017EP
Title (EN) COMPOSITION FOR TIN ALLOY ELECTROPLATING COMPRISING LEVELING AGENT
(FR) COMPOSITION D'ÉLECTROPLACAGE D'ALLIAGE D'ÉTAIN COMPRENANT UN AGENT DE NIVELLEMENT
Abstract:
(EN) The present invention relates to the use of an aqueous composition comprising tin ions optionally further alloy metal ions selected from silver, copper, indium, and bismuth ions and at least one additive comprising a linear or branched polyimidazolium compound comprising the structural unit of formula (L1) for depositing tin or tin alloy containing layers and a process for depositing tin alloy layer onto a substrate.
(FR) La présente invention concerne l'utilisation d'une composition aqueuse comprenant des ions étain, éventuellement d'autres ions métalliques d'alliage choisis parmi des ions argent, cuivre, indium et bismuth, et au moins un additif comprenant un composé polyimidazolium linéaire ou ramifié comprenant l'unité structurale de formule L1 (L1), destinée à déposer des couches contenant de l'étain ou un alliage d'étain, et un procédé destiné à déposer une couche d'alliage d'étain sur un substrat.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)