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1. (WO2018219545) DEVICE, SYSTEM AND METHOD FOR DRYING A SEMICONDUCTOR WAFER

Pub. No.:    WO/2018/219545    International Application No.:    PCT/EP2018/059682
Publication Date: Fri Dec 07 00:59:59 CET 2018 International Filing Date: Tue Apr 17 01:59:59 CEST 2018
IPC: H01L 21/67
B06B 1/06
B08B 3/12
H01L 21/683
Applicants: CURO GMBH
Inventors: BUCHMANN, Harald
KENZLERS, Guido
Title: DEVICE, SYSTEM AND METHOD FOR DRYING A SEMICONDUCTOR WAFER
Abstract:
The invention relates to a device for drying a semiconductor wafer (1), wherein the device has at least one generation unit (3) for generating surface acoustic waves, the generation unit (3) has at least one application unit (4) for applying the surface acoustic waves to a surface of the semiconductor wafer (1), and the generation unit (3) is designed to apply the surface acoustic waves such that the surface tension of a fluid located on the semiconductor wafer (1) is reduced and/or the semiconductor wafer (1) is dried.