Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2018219270) PACKAGING STRUCTURE AND PACKAGING METHOD FOR OLED DISPLAY COMPONENT, AND DISPLAY DEVICE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/219270 International Application No.: PCT/CN2018/088850
Publication Date: 06.12.2018 International Filing Date: 29.05.2018
IPC:
H01L 51/52 (2006.01) ,H01L 51/56 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52
Details of devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56
Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
Applicants:
京东方科技集团股份有限公司 BOE TECHNOLOGY GROUP CO., LTD. [CN/CN]; 中国北京市 朝阳区酒仙桥路10号 No.10 Jiuxianqiao Rd., Chaoyang District Beijing 100015, CN
合肥鑫晟光电科技有限公司 HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD. [CN/CN]; 中国安徽省合肥市 新站区工业园内 Xinzhan Industrial Park Hefei, Anhui 230012, CN
Inventors:
王玉林 WANG, Yulin; CN
Agent:
北京银龙知识产权代理有限公司 DRAGON INTELLECTUAL PROPERTY LAW FIRM; 中国北京市 海淀区西直门北大街32号院枫蓝国际中心2号楼10层 10F, Bldg. 2, Maples International Center No. 32 Xizhimen North Street, Haidian District Beijing 100082, CN
Priority Data:
201710408525.202.06.2017CN
Title (EN) PACKAGING STRUCTURE AND PACKAGING METHOD FOR OLED DISPLAY COMPONENT, AND DISPLAY DEVICE
(FR) STRUCTURE D'ENCAPSULATION ET PROCÉDÉ D'ENCAPSULATION POUR COMPOSANT D'AFFICHAGE À OLED, ET DISPOSITIF D'AFFICHAGE
(ZH) OLED显示器件的封装结构、封装方法、显示装置
Abstract:
(EN) Disclosed are a packaging structure and a packaging method for an OLED display component, and a display device. The packaging method for the OLED display component comprises: providing a substrate, the substrate comprising a packaging area and a binding area located around the packaging area, a binding electrode lead being provided on the binding area; forming a sacrificial layer on the binding electrode lead; forming an OLED display component in the packaging area; forming a packaging thin film covering the packaging area and the binding area; removing the sacrificial layer, thus allowing the sacrificial layer and the packaging thin film arranged on the sacrificial layer to be separated from the substrate. The packaging method provided in the present disclosure for the OLED display component is for use in packaging the OLED display component.
(FR) L'invention concerne une structure d'encapsulation et un procédé d'encapsulation pour un composant d'affichage à OLED, et un dispositif d'affichage. Le procédé d'encapsulation pour le composant d'affichage à OLED consiste à : fournir un substrat, le substrat comprenant une zone d'encapsulation et une zone de liaison située autour de la zone d'encapsulation, un fil d'électrode de liaison étant disposé sur la zone de liaison; former une couche sacrificielle sur le fil d'électrode de liaison; former un composant d'affichage à OLED dans la zone d'encapsulation; former un film mince d'encapsulation recouvrant la zone d'encapsulation et la zone de liaison; retirer la couche sacrificielle, permettant ainsi à la couche sacrificielle et au film mince d'encapsulation disposés sur la couche sacrificielle d'être séparés du substrat. Le procédé d'encapsulation selon la présente invention pour le composant d'affichage à OLED est destiné à être utilisé dans l'encapsulation du composant d'affichage à OLED.
(ZH) 本公开公开一种OLED显示器件的封装结构、封装方法、显示装置。该OLED显示器件的封装方法包括:提供一基板,所述基板包括封装区域和位于封装区域周边的绑定区域,所述绑定区域上设置有绑定电极引线;在所述绑定电极引线上形成牺牲层;在所述封装区域形成OLED显示器件;形成覆盖所述封装区域和所述绑定区域的封装薄膜;去除所述牺牲层,使得所述牺牲层和位于所述牺牲层上的封装薄膜从所述基板上分离。本公开提供的OLED显示器件的封装方法用于封装OLED显示器件。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)