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1. (WO2018219220) SEMI-EMBEDDED CIRCUIT SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREFOR

Pub. No.:    WO/2018/219220    International Application No.:    PCT/CN2018/088362
Publication Date: Fri Dec 07 00:59:59 CET 2018 International Filing Date: Sat May 26 01:59:59 CEST 2018
IPC: H01L 23/498
H01L 21/48
Applicants: NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD
华进半导体封装先导技术研发中心有限公司
Inventors: YU, Zhongyao
于中尧
Title: SEMI-EMBEDDED CIRCUIT SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREFOR
Abstract:
An embodiment of the present invention provides a semi-embedded circuit substrate structure, comprising: a semi-cured substrate, and a semi-embedded circuit disposed in the semi-cured substrate in a semi-embedded manner. A first face of the semi-embedded circuit is positioned above the surface of the semi-cured substrate which is located on the same side of the circuit, and a second face of the semi-embedded circuit, opposite to the first face, is positioned below the surface of the semi-cured substrate which is located on the same side of the circuit. A part of a side surface of the semi-embedded circuit is positioned above the surface of the semi-cured substrate which is located on the same side of the circuit, and the other part of the side surface of the semi-embedded circuit is wrapped by the semi-cured substrate.