Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2018218849) ROTATIONAL EUTECTIC SOLDERING STATION FOR CHIPS
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/218849 International Application No.: PCT/CN2017/106399
Publication Date: 06.12.2018 International Filing Date: 17.10.2017
IPC:
H01L 21/683 (2006.01) ,H01L 21/687 (2006.01) ,H01L 21/60 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
687
using mechanical means, e.g. chucks, clamps or pinches
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
Applicants:
广东瑞谷光网通信股份有限公司 GUANGDONG RUIGU OPTICAL NETWORK COMMUNICATION CO., LTD. [CN/CN]; 中国广东省东莞市 长安镇上沙社区福康路2号 No.2, Fu Kang Road, ShangSha Community, Chang An Town Dongguan, Guangdong 523000, CN
Inventors:
代克明 DAI, Keming; CN
肖华平 XIAO, Huaping; CN
Agent:
深圳市创富知识产权代理有限公司 SHENZHEN CREATEFORTUNE IP AGENCY CO., LTD.; 中国广东省深圳市 福田区华强北街道深南中路2064号华能大厦1003 Room 1003, Huaneng Building, No.2064, Shennan Road, Huaqiang North Street, Futian District Shenzhen, Guangdong 518031, CN
Priority Data:
201710407869.102.06.2017CN
Title (EN) ROTATIONAL EUTECTIC SOLDERING STATION FOR CHIPS
(FR) STATION DE BRASAGE EUTECTIQUE ROTATIVE POUR PUCES
(ZH) 芯片旋转共晶焊接台
Abstract:
(EN) Disclosed is a rotational eutectic soldering station for chips, the soldering station comprising a base plate (30), wherein a nozzle movable platform and a soldering station movable platform are fixed on the base plate, the nozzle movable platform is provided with a nozzle rotational electric motor (7) for driving a rotational nozzle (10) to rotate on a vertical face, the soldering station movable platform is provided with a soldering station rotational electric motor (23) for driving a eutectic soldering station to rotate horizontally, the rotational nozzle comprises four vacuum nozzles (9) provided uniformly circumferentially, the eutectic soldering station is provided with at least two soldering stations, material feeding holes of a tube base of the soldering stations are provided circumferentially, and the vacuum nozzles absorb the tube base (8). The invention has the advantages of improving machining efficiency and the area occupied by the equipment being small.
(FR) L'invention concerne une station de brasage eutectique rotative pour puces, la station de brasage comprenant une plaque de base (30), une plateforme mobile de buse et une plateforme mobile de station de brasage étant fixées sur la plaque de base, la plate-forme mobile de buse comprend un moteur électrique rotatif de buse (7) pour amener une buse rotative (10) à tourner sur une face verticale, la plateforme mobile de station de brasage comprenant un moteur électrique rotatif de station de brasage (23) pour amener une station de brasage eutectique à tourner horizontalement, la buse rotative comprend quatre buses à vide (9) disposées uniformément de manière circonférentielle, la station de brasage eutectique comprenant au moins deux stations de brasage, des trous d'alimentation en matériau d'une base de tube des stations de brasage sont disposés de manière circonférentielle, et les buses à vide absorbent la base de tube (8). L'invention présente les avantages d'améliorer l'efficacité d'usinage et la surface occupée par l'équipement qui est petite.
(ZH) 一种芯片旋转共晶焊接台,包括底板(30),底板上固定有吸嘴移动平台和焊台移动平台,吸嘴移动平台上设置有一驱动旋转吸嘴(10)在竖直面旋转吸嘴旋转电机(7),焊台移动平台上设置有一驱动共晶焊台水平旋转的焊台旋转电机(23),旋转吸嘴包括周向均匀设置的四个真空吸嘴(9),共晶焊台上至少设置有二个焊台,焊台的管座进料孔周向设置,真空吸嘴上吸附有管座(8)。具有能提高加工效率、设备占用场所面积小的优点。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)