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1. (WO2018218670) FINGERPRINT CHIP PACKAGING MODULE, FINGERPRINT RECOGNITION MODULE AND PACKAGING METHOD

Pub. No.:    WO/2018/218670    International Application No.:    PCT/CN2017/087024
Publication Date: Fri Dec 07 00:59:59 CET 2018 International Filing Date: Sat Jun 03 01:59:59 CEST 2017
IPC: G06K 9/00
Applicants: SHENZHEN GOODIX TECHNOLOGY CO., LTD.
深圳市汇顶科技股份有限公司
Inventors: LONG, Wei
龙卫
Title: FINGERPRINT CHIP PACKAGING MODULE, FINGERPRINT RECOGNITION MODULE AND PACKAGING METHOD
Abstract:
A fingerprint chip packaging module, a fingerprint recognition module and a packaging method, the fingerprint recognition chip packaging module comprising: a fingerprint recognition chip (201) and a number N of piezoresistive sensors (202), a first surface of the fingerprint recognition chip (201) having solder pads (421, 422, 423, 424), the first surface being an upper surface or a lower surface of the fingerprint recognition chip (201); some or all of the N piezoresistive sensors (202) are adhered to the first surface of the fingerprint recognition chip (201), each piezoresistive sensor (202) of the N piezoresistive sensors (202) being connected to a solder pad (421, 422, 423, 424). The present structure may use piezoresistive sensors (202) to acquire a pressure exerted by a user on a fingerprint recognition chip (201), decreasing piezoresistive sensor (202) calibration instances and noise, and increasing sensitivity of the piezoresistive sensors (202) used, so as to recognize more levels of pressure.