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1. (WO2018207821) INSULATING SHEET AND LAMINATE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/207821 International Application No.: PCT/JP2018/017935
Publication Date: 15.11.2018 International Filing Date: 09.05.2018
IPC:
H01B 3/00 (2006.01) ,B32B 7/02 (2006.01) ,B32B 27/18 (2006.01) ,C01B 21/064 (2006.01) ,C08J 5/18 (2006.01) ,C08K 3/38 (2006.01) ,C08K 7/00 (2006.01) ,C08L 63/00 (2006.01) ,C08L 101/00 (2006.01) ,H01L 23/36 (2006.01) ,H05K 1/03 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
3
Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
7
Layered products characterised by the relation between layers, i.e. products essentially comprising layers having different physical properties or products characterised by the interconnection of layers
02
in respect of physical properties, e.g. hardness
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
18
characterised by the use of special additives
C CHEMISTRY; METALLURGY
01
INORGANIC CHEMISTRY
B
NON-METALLIC ELEMENTS; COMPOUNDS THEREOF
21
Nitrogen; Compounds thereof
06
Binary compounds of nitrogen with metals, with silicon, or with boron
064
with boron
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
18
Manufacture of films or sheets
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
38
Boron-containing compounds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
7
Use of ingredients characterised by shape
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101
Compositions of unspecified macromolecular compounds
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
Applicants:
積水化学工業株式会社 SEKISUI CHEMICAL CO., LTD. [JP/JP]; 大阪府大阪市北区西天満2丁目4番4号 4-4, Nishitemma 2-chome, Kita-ku, Osaka-shi, Osaka 5308565, JP
Inventors:
杉本 匡隆 SUGIMOTO, Masataka; JP
大鷲 圭吾 OOWASHI, Keigo; JP
足羽 剛児 ASHIBA, Kouji; JP
川原 悠子 KAWAHARA, Yuko; JP
Agent:
特許業務法人 宮▲崎▼・目次特許事務所 MIYAZAKI & METSUGI; 大阪府大阪市中央区常盤町1丁目3番8号 中央大通FNビル Chuo Odori FN Bldg., 3-8, Tokiwamachi 1-chome, Chuo-ku, Osaka-shi, Osaka 5400028, JP
Priority Data:
2017-09425810.05.2017JP
Title (EN) INSULATING SHEET AND LAMINATE
(FR) FEUILLE ISOLANTE ET STRATIFIÉ
(JA) 絶縁性シート及び積層体
Abstract:
(EN) Provided is an insulating sheet which can effectively enhance thermal conductivity and adhesiveness, and which can effectively suppress the occurrence of voids. This insulating sheet includes a thermosetting component and boron nitride, and has a first surface on one side in the thickness direction and a second surface on the other side in the thickness direction. A first average long diameter of the boron nitride in a region occupying 10% of the thickness of the sheet from the first surface toward the second surface is smaller than a second average long diameter of the boron nitride in a region occupying 90% of the thickness from the second surface toward the first surface.
(FR) L'invention concerne une feuille isolante permettant d'améliorer efficacement la conductivité thermique et l'adhésivité, et de supprimer efficacement l'apparition de vides. Cette feuille isolante comprend un composant thermodurcissable et du nitrure de bore, et présente une première surface sur une face dans le sens de l'épaisseur, et une seconde surface sur l'autre face dans le sens de l'épaisseur. Un premier diamètre long moyen du nitrure de bore, dans une région occupant 10 % de l'épaisseur de la feuille depuis la première surface en direction de la seconde surface, est inférieur à un second diamètre long moyen du nitrure de bore dans une région occupant 90 % de l'épaisseur depuis la seconde surface en direction de la première surface.
(JA) 熱伝導性及び接着性を効果的に高めることができ、かつ、ボイドの発生を効果的に抑制することができる絶縁性シートを提供する。 本発明に係る絶縁性シートは、熱硬化性成分と、窒化ホウ素とを含み、厚み方向の一方側の第1の表面と、厚み方向の他方側の第2の表面とを有し、前記第1の表面から前記第2の表面に向かって厚み10%の領域における前記窒化ホウ素の第1の平均長径が、前記第2の表面から前記第1の表面に向かって厚み90%の領域における前記窒化ホウ素の第2の平均長径よりも小さい。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)