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1. WO2018206594 - COMPONENT HAVING EMV PROTECTION FOR AN ELECTRONIC BOARD

Publication Number WO/2018/206594
Publication Date 15.11.2018
International Application No. PCT/EP2018/061904
International Filing Date 08.05.2018
IPC
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
9
Screening of apparatus or components against electric or magnetic fields
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
10
in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
10
in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
12
using printing techniques to apply the conductive material
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
28
Applying non-metallic protective coatings
H05K 9/00 (2006.01)
H05K 1/02 (2006.01)
H05K 3/10 (2006.01)
H05K 3/12 (2006.01)
H05K 3/28 (2006.01)
CPC
H05K 1/0224
H05K 1/0225
H05K 3/107
H05K 3/1258
H05K 3/284
H05K 9/0047
Applicants
  • MAGNA POWERTRAIN BAD HOMBURG GMBH [DE/DE]; Georg-Schaeffler-Straße 3 61352 Bad Homburg, DE
Inventors
  • ACHATHALER, Christian; AT
  • KNOSPE, Dennis Christian; AT
  • RESCHER, Martin; AT
  • SCHLEICHER, Daniel; AT
  • SIGMUND, Christoph; AT
Agents
  • HOFFMANN EITLE PATENT- UND RECHTSANWÄLTE PARTMBB; Attn. Peter Wiedemann Arabellastraße 30 81925 München, DE
Priority Data
10 2017 208 075.212.05.2017DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) BAUTEIL MIT EMV SCHUTZ FÜR ELEKTRONISCHE PLATINE
(EN) COMPONENT HAVING EMV PROTECTION FOR AN ELECTRONIC BOARD
(FR) COMPOSANT DOTÉ D'UNE PROTECTION CEM ET DESTINÉ À UNE PLATINE ÉLECTRONIQUE
Abstract
(DE)
Es wird ein Bauteil mindestens bestehend aus elektronischen und/oder elektrischen Komponenten vorgeschlagen, die auf einer oder mehreren Platinen montiert oder damit verbunden sind, wobei die Komponenten mit der Platine mit einer ersten und einer zweiten Kunststoffschicht umspritzt sind, und wobei mindestens eine Abschirmung gegen elektromagnetische Strahlung vorhanden ist, wobei die Abschirmung aus einer Gitterstruktur (6) besteht und die Strukturen (5) aus freigelassenen Stellen in der Abschirmung (13) bestehen. Weiterhin betrifft die Erfindung ein Verfahren zur Herstellung eines solchen Bauteils.
(EN)
The invention relates to a component, at least comprising electronic and/or electric components, which are mounted on one or on a plurality of boards, or are connected thereto, wherein the components, together with the board, are over-molded with a first and a second plastic layer. There is at least one shielding against electromagnetic radiation, wherein the shielding consists of a grid structure (6), and the structures (5) consist of exposed points in the shielding (13). The invention further relates to a method for producing such a component.
(FR)
L'invention concerne un élément structural comprenant des composants électroniques et/ou électriques, qui sont montés sur une ou plusieurs platines ou sont reliés à elle(s), les composants et la platine étant enrobés par injection d'une première et d'une deuxième couche plastique, et au moins un blindage contre le rayonnement électromagnétique étant présent, le blindage étant constitué d'une structure quadrillée (6) et les structures (5) étant constituées d'emplacements exposés dans le blindage (13). La présente invention concerne également un procédé de production d'un tel élément structural.
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