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1. (WO2018205404) ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD FOR WAFER

Pub. No.:    WO/2018/205404    International Application No.:    PCT/CN2017/093143
Publication Date: Fri Nov 16 00:59:59 CET 2018 International Filing Date: Tue Jul 18 01:59:59 CEST 2017
IPC: C25D 7/12
H01L 21/288
H01L 21/445
Applicants: PICO INSTITUTE OF SMART CHIP (SHENZHEN) CO., LTD.
创弘智能芯片研究院(深圳)有限公司
Inventors: LEE, Junho
李俊镐
LIU, Zhiyu
刘智宇
CHEUNG, Kai Leung
张启亮
Title: ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD FOR WAFER
Abstract:
Provided is an electroplating apparatus for a wafer, the electroplating apparatus comprising a single operating chamber (7) and a plurality of storage tanks (121, 122, 123, 124, 125, 126) for storing liquids, wherein the plurality of storage tanks are respectively led to the single operating chamber (7) through pipes, and successively provide the single operating chamber (7) with the stored liquids in a controlled manner; and the single operating chamber (7) is constructed so as to separately receive the liquids from one or more storage tanks in a controlled manner, and holds a wafer (3) in a position-fixed manner, such that the wafer (3) is applied with a plating in the single operating chamber (7). The invention integrates different processes of wafer electroplating to complete same in one operating chamber, thus reducing the risk of physical damage to the wafer, simplifying the structure of the electroplating apparatus, reducing the production and maintenance costs of the electroplating apparatus, and improving the production efficiency of the electroplating apparatus. Also provided is an electroplating method for a wafer, and the electroplating method is performed by means of the electroplating apparatus as stated above.