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|1. (WO2018205404) ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD FOR WAFER|
|Applicants:||PICO INSTITUTE OF SMART CHIP (SHENZHEN) CO., LTD.
CHEUNG, Kai Leung
|Title:||ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD FOR WAFER|
Provided is an electroplating apparatus for a wafer, the electroplating apparatus comprising a single operating chamber (7) and a plurality of storage tanks (121, 122, 123, 124, 125, 126) for storing liquids, wherein the plurality of storage tanks are respectively led to the single operating chamber (7) through pipes, and successively provide the single operating chamber (7) with the stored liquids in a controlled manner; and the single operating chamber (7) is constructed so as to separately receive the liquids from one or more storage tanks in a controlled manner, and holds a wafer (3) in a position-fixed manner, such that the wafer (3) is applied with a plating in the single operating chamber (7). The invention integrates different processes of wafer electroplating to complete same in one operating chamber, thus reducing the risk of physical damage to the wafer, simplifying the structure of the electroplating apparatus, reducing the production and maintenance costs of the electroplating apparatus, and improving the production efficiency of the electroplating apparatus. Also provided is an electroplating method for a wafer, and the electroplating method is performed by means of the electroplating apparatus as stated above.