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1. (WO2018204091) COMPUTING DEVICES WITH AN ADHERED COVER AND METHODS OF MANUFACTURING THEREOF
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Pub. No.: WO/2018/204091 International Application No.: PCT/US2018/028462
Publication Date: 08.11.2018 International Filing Date: 20.04.2018
IPC:
G06F 1/16 (2006.01) ,G06F 1/18 (2006.01) ,H05K 5/02 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
1
Details not covered by groups G06F3/-G06F13/82
16
Constructional details or arrangements
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
1
Details not covered by groups G06F3/-G06F13/82
16
Constructional details or arrangements
18
Packaging or power distribution
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
5
Casings, cabinets or drawers for electric apparatus
02
Details
Applicants:
MICROSOFT TECHNOLOGY LICENSING, LLC [US/US]; One Microsoft Way Redmond, Washington 98052-6399, US
Inventors:
EVANS, Ryan Travis; US
SCHULTZ, Bernard Maurice, III; US
TRIPARD, Jason Edward; US
SHAH, Ketan R.; US
Agent:
MINHAS, Sandip S.; US
CHEN, Wei-Chen Nicholas; US
DRAKOS, Katherine J.; US
HINOJOSA, Brianna L.; US
HOLMES, Danielle J.; US
SWAIN, Cassandra T.; US
WONG, Thomas S.; US
CHOI, Daniel; US
HWANG, William C.; US
WIGHT, Stephen A.; US
CHATTERJEE, Aaron C.; US
Priority Data:
15/691,96531.08.2017US
62/492,43101.05.2017US
Title (EN) COMPUTING DEVICES WITH AN ADHERED COVER AND METHODS OF MANUFACTURING THEREOF
(FR) DISPOSITIFS INFORMATIQUES AVEC UN COUVERCLE COLLÉ ET PROCÉDÉS DE FABRICATION ASSOCIÉS
Abstract:
(EN) A computing device is described. The computing device includes a support structure with an interface surface that has a cross-sectional width. The computing device includes a cover adhered to the interface surface of the support structure along an entirety of the cross-sectional width of the interface surface. A method of manufacturing a computing device is described. The method includes applying an adhesive to a cover. A support structure of a computing device is heated. The support structure is cooled. While the support structure is heated and cooled, pressure is applied to the cover.
(FR) L'invention concerne un dispositif informatique. Le dispositif informatique comprend une structure de support ayant une surface d'interface qui a une largeur en coupe transversale. Le dispositif informatique comprend un couvercle collé à la surface d'interface de la structure de support le long d'une totalité de la largeur en coupe transversale de la surface d'interface. La présente invention concerne un procédé de fabrication du dispositif informatique. Le procédé comprend l'application d'un adhésif sur un couvercle. Une structure de support du dispositif informatique est chauffée. La structure de support est refroidie. Pendant que la structure de support est chauffée et refroidie, une pression est appliquée au couvercle.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)