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1. (WO2018204086) DUAL-SIDED MEMORY MODULE WITH CHANNELS ALIGNED IN OPPOSITION
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Pub. No.: WO/2018/204086 International Application No.: PCT/US2018/028387
Publication Date: 08.11.2018 International Filing Date: 19.04.2018
IPC:
G11C 5/04 (2006.01) ,G11C 5/06 (2006.01) ,H05K 1/02 (2006.01) ,H01L 25/10 (2006.01)
G PHYSICS
11
INFORMATION STORAGE
C
STATIC STORES
5
Details of stores covered by group G11C11/63
02
Disposition of storage elements, e.g. in the form of a matrix array
04
Supports for storage elements; Mounting or fixing of storage elements on such supports
G PHYSICS
11
INFORMATION STORAGE
C
STATIC STORES
5
Details of stores covered by group G11C11/63
06
Arrangements for interconnecting storage elements electrically, e.g. by wiring
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
10
the devices having separate containers
Applicants:
APPLE INC. [US/US]; One Apple Park Way Cupertino, CA 95014, US
Inventors:
KELLY, James, D.; US
RADKE, William, H.; US
SFARZO, Steven, J.; US
Agent:
AIKIN, Jacob; US
Priority Data:
15/817,06617.11.2017US
62/502,55405.05.2017US
Title (EN) DUAL-SIDED MEMORY MODULE WITH CHANNELS ALIGNED IN OPPOSITION
(FR) MODULE DE MÉMOIRE DOUBLE FACE À CANAUX ALIGNÉS EN OPPOSITION
Abstract:
(EN) Memory packages, memory modules, and circuit boards are described. In an embodiment, single channel memory packages are mounted on opposite sides of a circuit board designed with a first side also designed to accept dual channel memory packages. Alternatively, dual channel memory packages may be mounted on a first side of a circuit board that is also designed to accept single channel packages on opposite sides.
(FR) L'invention concerne des boîtiers de mémoire, des modules de mémoire et des cartes de circuits imprimés. Selon un mode de réalisation, des boîtiers de mémoire à canal unique sont montés sur des côtés opposés d'une carte de circuit imprimé conçue avec un premier côté conçu également pour accepter des boîtiers de mémoire à double canal. En variante, des boîtiers de mémoire à double canal peuvent être montés sur un premier côté d'une carte de circuit imprimé qui est également conçue pour accepter des des boîtiers à canal unique sur des des côtés opposés.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)