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1. (WO2018204014) INDUCTORS WITH THROUGH-SUBSTRATE VIA CORES

Pub. No.:    WO/2018/204014    International Application No.:    PCT/US2018/026256
Publication Date: Fri Nov 09 00:59:59 CET 2018 International Filing Date: Fri Apr 06 01:59:59 CEST 2018
IPC: H01L 49/02
H01L 21/768
Applicants: MICRON TECHNOLOGY, INC.
Inventors: KIRBY, Kyle, K.
Title: INDUCTORS WITH THROUGH-SUBSTRATE VIA CORES
Abstract:
A semiconductor device comprising a substrate is provided. The device further comprises a through-substrate via (TSV) extending into the substrate, and a substantially helical conductor disposed around the TSV. The substantially helical conductor can be configured to generate a magnetic field in the TSV in response to a current passing through the helical conductor. More than one TSV can be included, and/or more than one substantially helical conductor can be provided.