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1. (WO2018204013) SEMICONDUCTOR DEVICES WITH THROUGH-SUBSTRATE COILS FOR WIRELESS SIGNAL AND POWER COUPLING

Pub. No.:    WO/2018/204013    International Application No.:    PCT/US2018/026253
Publication Date: Fri Nov 09 00:59:59 CET 2018 International Filing Date: Fri Apr 06 01:59:59 CEST 2018
IPC: H01L 23/00
H01L 23/528
Applicants: MICRON TECHNOLGY, INC.
Inventors: KIRBY, Kyle, K.
Title: SEMICONDUCTOR DEVICES WITH THROUGH-SUBSTRATE COILS FOR WIRELESS SIGNAL AND POWER COUPLING
Abstract:
A semiconductor device comprising a substrate and a substantially spiral- shaped conductor is provided. The substantially spiral-shaped conductor extends substantially into the substrate and has a spiral axis substantially perpendicular to a surface of the substrate. The substantially spiral-shaped conductor can be configured to be wirelessly coupled to another substantially spiral-shaped conductor in another semiconductor device.