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1. (WO2018203527) ADHESIVE FILM, TAPE FOR PROCESSING SEMICONDUCTOR WAFER, SEMICONDUCTOR PACKAGE, AND PRODUCTION METHOD THEREFOR
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Pub. No.: WO/2018/203527 International Application No.: PCT/JP2018/017199
Publication Date: 08.11.2018 International Filing Date: 27.04.2018
IPC:
C09J 7/10 (2018.01) ,C09J 7/35 (2018.01) ,C09J 11/04 (2006.01) ,C09J 11/06 (2006.01) ,C09J 163/00 (2006.01) ,C09J 171/10 (2006.01) ,C09J 201/00 (2006.01) ,H01L 21/52 (2006.01)
[IPC code unknown for C09J 7/10][IPC code unknown for C09J 7/35]
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
04
inorganic
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
06
organic
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
163
Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
171
Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
08
Polyethers derived from hydroxy compounds or from their metallic derivatives
10
from phenols
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201
Adhesives based on unspecified macromolecular compounds
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
52
Mounting semiconductor bodies in containers
Applicants:
古河電気工業株式会社 FURUKAWA ELECTRIC CO., LTD. [JP/JP]; 東京都千代田区丸の内2丁目2番3号 2-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008322, JP
Inventors:
切替 徳之 KIRIKAE, Noriyuki; JP
佐野 透 SANO, Toru; JP
森田 稔 MORITA, Minoru; JP
Agent:
特許業務法人イイダアンドパートナーズ IIDA & PARTNERS; 東京都港区新橋3丁目1番10号 石井ビル3階 ISHII Bldg. 3F, 1-10, Shimbashi 3-chome, Minato-ku, Tokyo 1050004, JP
飯田 敏三 IIDA, Toshizo; JP
赤羽 修一 AKABA, Shuichi; JP
Priority Data:
2017-09135101.05.2017JP
Title (EN) ADHESIVE FILM, TAPE FOR PROCESSING SEMICONDUCTOR WAFER, SEMICONDUCTOR PACKAGE, AND PRODUCTION METHOD THEREFOR
(FR) FILM ADHÉSIF, RUBAN POUR TRAITER UNE TRANCHE DE SEMI-CONDUCTEUR, BOÎTIER DE SEMI-CONDUCTEUR ET PROCÉDÉ POUR SA PRODUCTION
(JA) 接着フィルム、半導体ウェハ加工用テープ、半導体パッケージおよびその製造方法
Abstract:
(EN) Provided are: an adhesive film comprising an adhesive agent layer containing a thermosetting resin, a thermoplastic resin, and a heat conductive filler, wherein the heat conductive filler has a thermal conductivity of 12 W/m·K or more and is contained in an amount of 30-50 vol% in the adhesive agent layer, the thermoplastic resin contains at least one type of phenoxy resin, and the cured adhesive agent layer has a reliability coefficient S1 of 50-220 (× 10-6 GPa) as calculated according to mathematical formula (1), a reliability coefficient S2 of 10-120 (× 10-8 GPa) as calculated according to mathematical formula (2), and a thermal conductivity of 0.5 W/m·K or more; a tape for processing a semiconductor wafer; a semiconductor package; and a production method therefor. In mathematical formulas (1) and (2), S1, S2, Tg, CTEα1, a storage modulus E', and the saturated water absorption rate WA are of the adhesive agent layer after being cured. Tg represents a glass transition temperature, CTEα1 represents a linear expansion coefficient at the glass transition temperature or less, and the storage modulus E' is a value measured at 260ºC. In addition, units are given in brackets [].
(FR) L'invention concerne : un film adhésif comprenant une couche d'agent adhésif contenant une résine thermodurcissable, une résine thermoplastique et une charge thermoconductrice, la charge thermoconductrice présentant une conductivité thermique de 12 W/m·K ou plus et étant contenue en une quantité de 30 à 50 % en volume dans la couche d'agent adhésif, la résine thermoplastique contenant au moins un type de résine phénoxy et la couche d'agent adhésif durcie présentant un coefficient de fiabilité S1 de 50-220 (× 10-6 GPa) tel que calculé selon la formule mathématique (1), un coefficient de fiabilité S2 de 10-120 (× 10-8 GPa) tel que calculé selon la formule mathématique (2) et une conductivité thermique de 0,5 W/m·K ou plus ; un ruban pour le traitement d'une tranche de semi-conducteur ; un boîtier de semi-conducteur ; et un procédé pour sa production. Dans les formules mathématiques (1) et (2), S1, S2, Tg, CTEα1, un module de conservation E' et le taux d'absorption à saturation d'eau WA sont ceux de la couche d'agent adhésif après durcissement. Tg représente une température de transition vitreuse, CTEα1 représente un coefficient de dilatation linéaire à la température de transition vitreuse ou moins et le module de conservation E' est une valeur mesurée à 260°C. De plus, les unités sont indiquées entre crochets [].
(JA) 熱硬化性樹脂、熱可塑性樹脂及び熱伝導フィラーを含有する接着剤層からなる接着フィルムであって、 前記熱伝導フィラーが、熱伝導率12W/m・K以上であって前記接着剤層中の含有量が30~50体積%であり、前記熱可塑性樹脂が少なくとも1種のフェノキシ樹脂を含み、かつ、硬化後の接着剤層が、 下記数式(1)で算出される信頼性係数S1が50~220(×10-6GPa)であり、下記数式(2)で算出される信頼性係数S2が10~120(×10-8GPa)であり、 熱伝導率が0.5W/m・K以上である接着フィルム、半導体ウェハ加工用テープ、半導体パッケージ及びその製造方法。 数式(1)、(2)において、S1、S2、Tg、CTEα1、貯蔵弾性率E'および飽和吸水率WAは、硬化後の接着剤層に対するものである。Tgはガラス転移温度であり、CTEα1は該ガラス転移温度以下での線膨張係数であり、貯蔵弾性率E'は260℃で測定した値である。また、[]内は単位を示す。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)