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1. (WO2018203487) CIRCUIT MODULE

Pub. No.:    WO/2018/203487    International Application No.:    PCT/JP2018/016304
Publication Date: Fri Nov 09 00:59:59 CET 2018 International Filing Date: Sat Apr 21 01:59:59 CEST 2018
IPC: H01L 23/28
H01L 23/00
H01L 23/29
H01L 23/31
H01L 25/04
H01L 25/18
Applicants: ALPS ELECTRIC CO., LTD.
アルプス電気株式会社
Inventors: KAWAMURA, Ayako
川村 綾子
Title: CIRCUIT MODULE
Abstract:
[Problem] To provide a resin-encapsulated-type circuit module that enables scraping off of an encapsulation resin material without ruining an electronic component subject to failure analysis. [Solution] The present invention pertains to a circuit module 100 provided with: a circuit substrate 30 having a mounting surface 30a; an electronic component 41 mounted to the mounting surface 30a; and an encapsulation resin layer 10 disposed on the mounting surface 30a side so as to cover the electronic component 41, wherein the encapsulation resin layer 10 is provided with an identification section 20 that is disposed in a position corresponding to the position of an outline of a particular electronic part 43 of the electronic component 41. This configuration, wherein the encapsulation resin layer 10 is provided with the identification section 20 that is disposed in the position corresponding to the position of the outline of the particular electronic part 43 subject to failure analysis, enables the easy identification of where the particular electronic part 43 is located, and thereby makes it possible to scrape off an encapsulation resin material 13 forming the encapsulation resin layer 10 without ruining the particular electronic part 43.