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1. (WO2018203430) ELASTIC WAVE ELEMENT AND METHOD FOR MANUFACTURING SAME
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Pub. No.: WO/2018/203430 International Application No.: PCT/JP2018/005882
Publication Date: 08.11.2018 International Filing Date: 20.02.2018
IPC:
H03H 9/25 (2006.01) ,H03H 3/08 (2006.01)
H ELECTRICITY
03
BASIC ELECTRONIC CIRCUITRY
H
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9
Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
25
Constructional features of resonators using surface acoustic waves
H ELECTRICITY
03
BASIC ELECTRONIC CIRCUITRY
H
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
3
Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
007
for the manufacture of electromechanical resonators or networks
08
for the manufacture of resonators or networks using surface acoustic waves
Applicants:
日本碍子株式会社 NGK INSULATORS, LTD. [JP/JP]; 愛知県名古屋市瑞穂区須田町2番56号 2-56, Suda-cho, Mizuho-ku, Nagoya-shi, Aichi 4678530, JP
Inventors:
多井 知義 TAI Tomoyoshi; JP
滑川 政彦 NAMERIKAWA Masahiko; JP
吉野 隆史 YOSHINO Takashi; JP
Agent:
細田 益稔 HOSODA Masutoshi; JP
青木 純雄 AOKI Sumio; JP
Priority Data:
2017-09164102.05.2017JP
Title (EN) ELASTIC WAVE ELEMENT AND METHOD FOR MANUFACTURING SAME
(FR) ÉLÉMENT D'ONDE ÉLASTIQUE ET SON PROCÉDÉ DE FABRICATION
(JA) 弾性波素子およびその製造方法
Abstract:
(EN) [Problem] To provide an elastic wave element in which a piezoelectric material substrate and a support substrate are joined together via a joining layer, wherein the elastic wave element has a structure with which it is possible to further improve elastic wave propagation loss and frequency temperature characteristics. [Solution] An elastic wave element comprising a piezoelectric material substrate 2A, an electrode 4 on the piezoelectric material substrate 2A, a support substrate 3, and a joining layer 1A for joining the piezoelectric material substrate 2A and the support substrate 3. The joining layer 1A comprises a crystal.
(FR) Le problème décrit par la présente invention est de fournir un élément d'onde élastique dans lequel un substrat de matériau piézoélectrique et un substrat de support sont joints ensemble par l'intermédiaire d'une couche de jonction, l'élément d'onde élastique ayant une structure avec laquelle il est possible de réduire davantage la perte de propagation d'onde élastique et d'améliorer les caractéristiques de température de fréquence. La solution selon l'invention porte sur un élément d'onde élastique comprenant un substrat de matériau piézoélectrique 2A, une électrode 4 sur le substrat de matériau piézoélectrique 2A, un substrat de support 3, et une couche de jonction 1A pour joindre le substrat de matériau piézoélectrique 2A et le substrat de support 3. La couche de jonction 1A comprend un cristal.
(JA) 【課題】圧電性材料基板と支持基板とを接合層を介して接合する弾性波素子において、弾性波の伝搬損失および周波数の温度特性を一層改善できる構造の弾性波素子を提供する。 【解決手段】弾性波素子は、圧電性材料基板2A、圧電性材料基板2A上の電極4、支持基板3、および圧電性材料基板2Aと支持基板3とを接合する接合層1Aを備える。接合層1Aが水晶からなる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)