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1. (WO2018202920) SOLDERING DEVICE AND METHOD FOR PRODUCING A SOLDER CONNECTION, USING BASE AND PRESSURE PLATES AND A STOP DEVICE

Pub. No.:    WO/2018/202920    International Application No.:    PCT/EP2018/061728
Publication Date: Fri Nov 09 00:59:59 CET 2018 International Filing Date: Tue May 08 01:59:59 CEST 2018
IPC: B23K 1/00
B23K 1/20
B23K 3/08
B23K 37/04
H05K 3/32
H05K 3/34
B23K 101/42
Applicants: PINK GMBH THERMOSYSTEME
Inventors: OETZEL, Christoph
HUTZLER, Aaron
Title: SOLDERING DEVICE AND METHOD FOR PRODUCING A SOLDER CONNECTION, USING BASE AND PRESSURE PLATES AND A STOP DEVICE
Abstract:
The invention relates to a soldering device (50) for producing a solder connection between a plurality of components (12A, 12B) by heating and melting solder material (16) which is arranged between the components to be joined (12A, 12B), and/or for coating a component with solder material (16). Said soldering device comprises a base plate (66) and a pressure plate (64) between which a solder group (10) comprising the one or more components (12A, 12B) and the solder material (16) is received, said plates being adjustable relative each other in terms of their distance in order to exert a pressing force on the solder group (10). The soldering device is provided with a stop device (68) which limits the distance between the base plate (66) and the pressure plate (64) to a minimum distance so that the solder group (10) has a predetermined thickness once the solder material (16) has melted. The invention also relates to a joining method whereby prior to application of a pressure force the components to be joined (12A, 12B) are temporarily joined by a solid or pasty adhesive material to form a solder group (10) in which the components (12A, 12B) are held in place relative to each other in a joining position.