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1. (WO2018202439) ELECTRONIC ASSEMBLY WITH A COMPONENT LOCATED BETWEEN TWO SUBSTRATES, AND METHOD FOR PRODUCING SAME

Pub. No.:    WO/2018/202439    International Application No.:    PCT/EP2018/060138
Publication Date: Fri Nov 09 00:59:59 CET 2018 International Filing Date: Sat Apr 21 01:59:59 CEST 2018
IPC: H01L 23/15
H01L 23/367
Applicants: SIEMENS AKTIENGESELLSCHAFT
Inventors: KNOFE, Rüdiger
MÜLLER, Bernd
STROGIES, Jörg
WILKE, Klaus
BLANK, Rene
FRANKE, Martin
FRÜHAUF, Peter
NERRETER, Stefan
Title: ELECTRONIC ASSEMBLY WITH A COMPONENT LOCATED BETWEEN TWO SUBSTRATES, AND METHOD FOR PRODUCING SAME
Abstract:
The invention relates to an electronic assembly with a component (11) that is held between a first substrate (12) and a second substrate (13). According to the invention, a gap (18) between the first substrate (12) and the component (11) is connected to a through-hole (21) such that a solder material (24), for example, can be dispensed through the through-hole using capillary forces acting in the through-hole (21) and in the gap (18). Dispensing is automatic, as the capillary forces only act in the gap. Tolerances, which can be necessary because of differing gap dimensions, can advantageously be compensated for by the automatic dispensing of the solder material. The invention further relates to a method for producing the assembly described, wherein joining adjuvant (24), particularly solder material, can be applied by selective wave soldering.