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|1. (WO2018202439) ELECTRONIC ASSEMBLY WITH A COMPONENT LOCATED BETWEEN TWO SUBSTRATES, AND METHOD FOR PRODUCING SAME|
|Title:||ELECTRONIC ASSEMBLY WITH A COMPONENT LOCATED BETWEEN TWO SUBSTRATES, AND METHOD FOR PRODUCING SAME|
The invention relates to an electronic assembly with a component (11) that is held between a first substrate (12) and a second substrate (13). According to the invention, a gap (18) between the first substrate (12) and the component (11) is connected to a through-hole (21) such that a solder material (24), for example, can be dispensed through the through-hole using capillary forces acting in the through-hole (21) and in the gap (18). Dispensing is automatic, as the capillary forces only act in the gap. Tolerances, which can be necessary because of differing gap dimensions, can advantageously be compensated for by the automatic dispensing of the solder material. The invention further relates to a method for producing the assembly described, wherein joining adjuvant (24), particularly solder material, can be applied by selective wave soldering.