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1. (WO2018202394) METHOD OF MEASURING A PARAMETER OF INTEREST, DEVICE MANUFACTURING METHOD, METROLOGY APPARATUS, AND LITHOGRAPHIC SYSTEM
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Pub. No.: WO/2018/202394 International Application No.: PCT/EP2018/059304
Publication Date: 08.11.2018 International Filing Date: 11.04.2018
IPC:
G03F 7/20 (2006.01) ,G03F 9/00 (2006.01) ,H01L 21/66 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20
Exposure; Apparatus therefor
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
9
Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66
Testing or measuring during manufacture or treatment
Applicants:
ASML NETHERLANDS B.V. [NL/NL]; P.O. Box 324 5500 AH Veldhoven, NL
Inventors:
LIAN, Jin; NL
PANDEY, Nitesh; NL
Agent:
BROEKEN, Petrus; NL
Priority Data:
17169624.805.05.2017EP
Title (EN) METHOD OF MEASURING A PARAMETER OF INTEREST, DEVICE MANUFACTURING METHOD, METROLOGY APPARATUS, AND LITHOGRAPHIC SYSTEM
(FR) PROCÉDÉ DE MESURE D'UN PARAMÈTRE D'INTÉRÊT, PROCÉDÉ DE FABRICATION DE DISPOSITIF, APPAREIL DE MÉTROLOGIE ET SYSTÈME LITHOGRAPHIQUE
Abstract:
(EN) Methods and apparatus for measuring a parameter of interest of a target structure formed on substrate are disclosed. In one arrangement, the target structure comprises a first sub-target and a second sub-target. The first sub-target comprises a first bias and the second sub-target comprises a second bias. The method comprises determining the parameter of interest using a detected or estimated reference property of radiation at a first wavelength scattered from the first sub-target and a detected or estimated reference property of radiation at a second wavelength scattered from the second sub-target. The first wavelength is different to the second wavelength.
(FR) L'invention concerne des procédés et un appareil de mesure d'un paramètre d'intérêt d'une structure cible formée sur un substrat. Dans une configuration, la structure cible comprend des première et seconde sous-cibles. La première sous-cible comprend une première polarisation et la seconde sous-cible comprend une seconde polarisation. Le procédé consiste : à déterminer le paramètre d'intérêt à l'aide d'une propriété de référence détectée ou estimée d'un rayonnement à une première longueur d'onde dispersée à partir de la première sous-cible et d'une propriété de référence détectée ou estimée d'un rayonnement à une seconde longueur d'onde diffusée à partir de la seconde sous-cible. La première longueur d'onde est différente de la seconde longueur d'onde.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)