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1. (WO2018201949) ULTRA-SMALL ELECTROMAGNETIC RELAY WITH HIGH STATIC CONTACT POINT POSITIONING PRECISION

Pub. No.:    WO/2018/201949    International Application No.:    PCT/CN2018/084478
Publication Date: Fri Nov 09 00:59:59 CET 2018 International Filing Date: Thu Apr 26 01:59:59 CEST 2018
IPC: H01H 50/56
H01H 50/14
Applicants: XIAMEN HONGFA SIGNAL ELECTRONICS CO., LTD.
厦门宏发信号电子有限公司
Inventors: LIN, Jiabin
林佳宾
Title: ULTRA-SMALL ELECTROMAGNETIC RELAY WITH HIGH STATIC CONTACT POINT POSITIONING PRECISION
Abstract:
Disclosed is an ultra-small electromagnetic relay with high static contact point positioning precision, comprising a static spring (1), a coil (2) and a base (3) which are integrated through injection moulding, wherein the static spring comprises a static spring body (11) for mounting a static contact point (4) and a static spring outgoing terminal (12) extending from the static spring body to an outer part of the base; in the static spring outgoing terminal, a first positioning part (121) in the injection moulding is arranged at a place corresponding to an edge in the width direction of the base; in the static spring body, an extended protruding stretching part (111) is arranged corresponding to the length direction of the base; the protruding stretching part extends to the exterior of the base and is used as a second positioning part in the injection moulding; and in the base, a through hole (31) penetrating through the base in the thickness direction is arranged at a position which corresponds to a back face of the static spring body provided with the static contact point, so that the back face, provided with the static contact point, of the static spring body is used as a third positioning part (112) in the injection moulding and can be supported and positioned by means of a positioning member passing through the through hole of the base. The consistency of the position of the contact point of the static spring can be greatly improved in the injection moulding process and after the injection moulding; consistency between contact point gaps of products and overtravel parameters is effectively improved; and product quality is thereby improved.