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1. (WO2018201837) SEMICONDUCTOR ENCAPSULATION STRUCTURE

Pub. No.:    WO/2018/201837    International Application No.:    PCT/CN2018/081601
Publication Date: Fri Nov 09 00:59:59 CET 2018 International Filing Date: Tue Apr 03 01:59:59 CEST 2018
IPC: H01L 23/10
H01L 21/52
Applicants: SHENZHEN REFOND OPTOELECTRONICS CO., LTD.
深圳市瑞丰光电子股份有限公司
Inventors: YOU, Zhi
游志
PEI, Xiaoming
裴小明
Title: SEMICONDUCTOR ENCAPSULATION STRUCTURE
Abstract:
Provided is a semiconductor encapsulation structure, containing: a component base (1) and cover panel (2); the component base is provided with a chamber (11); the chamber is used for accommodating a chip (3); the component base is also provided with a cover-panel sintered layer (12); the cover-panel sintered layer is metallized; the cover panel matches the component base; the cover panel is provided with a base sintered layer (22); the base sintered layer is also metallized; the cover panel is connected to the base by sintering. The cover panel is connected to the base by means of sintering, thus a low-temperature connection is achieved, preventing damage to the chip inside the component base and to electronic components that would otherwise result from high connection temperatures; even more importantly, packaging costs are substantially reduced while ensuring connection reliability.