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1. (WO2018201428) THERMALLY CURABLE SEALANT COMPOSITION AND USE THEREOF
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Pub. No.: WO/2018/201428 International Application No.: PCT/CN2017/083160
Publication Date: 08.11.2018 International Filing Date: 05.05.2017
IPC:
C08L 79/08 (2006.01) ,C08L 63/00 (2006.01) ,C09K 3/10 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08L61/-C08L77/259
04
Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
3
Materials not provided for elsewhere
10
for sealing or packing joints or covers
Applicants:
HENKEL AG & CO. KGAA [DE/DE]; Henkelstr. 67 40589 Düsseldorf, DE
HENKEL IP & HOLDING GMBH [DE/DE]; Henkelstr. 67 40589 Düsseldorf, DE
HENKEL (CHINA) CO., LTD. [CN/CN]; No.189, Guo Yuan Road Zhu Qiao Town, Pu Dong New Area Shanghai 201323, CN (SC)
Inventors:
JU, Zhenhua; CN
SHI, Zhuming; CN
LU, Cheng; CN
OUYANG, Jiangbo; US
GAO, Baoshan; CN
CHEN, Jinqian; CN
Agent:
NTD PATENT AND TRADEMARK AGENCY LIMITED; 中国北京市 东城区北三环东路36号北京环球贸易中心C座10层 10th Floor, Tower C, Beijing Global Trade Center 36 North Third Ring Road East, Dongcheng District Beijing 100013, CN
Priority Data:
Title (EN) THERMALLY CURABLE SEALANT COMPOSITION AND USE THEREOF
(FR) COMPOSITION DE MATÉRIAU D'ÉTANCHÉITÉ THERMODURCISSABLE ET UTILISATION ASSOCIÉE
Abstract:
(EN) A thermally curable sealant composition, comprising: a) a thermally curable resin selected from maleimide resins, maleimide-modified epoxy resins and any combination thereof;b) a latent curing agent;c) a polysiloxane containing a mercapto group;and optionally d) a stabilizer. The thermally curable sealant composition exhibits suitable gelling time and excellent storage stability. In addition, when used as one drop fill (ODF) sealant for liquid-crystal display (LCD) panels, the thermally curable sealant composition permits assembly of LCD panels without mutual migration of the sealant into the liquid crystal during LCD.
(FR) L'invention concerne une composition d'agent d'étanchéité thermodurcissable, comprenant : a) une résine thermodurcissable sélectionnée parmi les résines maléimide, les résines époxy modifiées par le maléimide et toute combinaison de celles-ci; b) un agent de durcissement latent; c) un polysiloxane contenant un groupe mercapto; et éventuellement d) un stabilisant. La composition d'agent d'étanchéité thermodurcissable présente un temps de gélification approprié et une excellente stabilité au stockage. De plus, lorsqu'il est utilisé comme agent d'étanchéité à remplissage goutte à goutte (ODF) pour des panneaux d'affichage à cristaux liquides (LCD), la composition d'agent d'étanchéité thermodurcissable permet l'assemblage de panneaux LCD sans migration mutuelle de l'agent d'étanchéité dans le cristal liquide pendant l'affichage à cristaux liquides.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)