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1. WO2018201425 - FAN-LESS CHILLER-LESS LIQUID-AIR COOLING FOR ELECTRONIC RACKS OF IT COMPONENTS IN DATA CENTERS

Publication Number WO/2018/201425
Publication Date 08.11.2018
International Application No. PCT/CN2017/083152
International Filing Date 05.05.2017
IPC
H05K 7/20 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
CPC
G06F 1/20
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/00G06F13/00 and G06F21/00
16Constructional details or arrangements
20Cooling means
H05K 7/20736
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
20709for server racks or cabinets; for data centers, e.g. 19-inch computer racks
20718Forced ventilation of a gaseous coolant
20736within cabinets for removing heat from server blades
H05K 7/20745
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
20709for server racks or cabinets; for data centers, e.g. 19-inch computer racks
20718Forced ventilation of a gaseous coolant
20745within rooms for removing heat from cabinets, e.g. by air conditioning device
H05K 7/20754
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
20709for server racks or cabinets; for data centers, e.g. 19-inch computer racks
20754Air circulating in closed loop within cabinets
H05K 7/20772
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
20709for server racks or cabinets; for data centers, e.g. 19-inch computer racks
20763Liquid cooling without phase change
20772within server blades for removing heat from heat source
H05K 7/2079
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
20709for server racks or cabinets; for data centers, e.g. 19-inch computer racks
20763Liquid cooling without phase change
2079within rooms for removing heat from cabinets
Applicants
  • BAIDU.COM TIMES TECHNOLOGY (BEIJING) CO., LTD. [CN]/[CN]
  • BAIDU USA LLC [US]/[US]
Inventors
  • GAO, Tianyi
  • CUI, Yan
  • SUN, Xiaogang
  • HEYDARI, Ali
Agents
  • INSIGHT INTELLECTUAL PROPERTY LIMITED
Priority Data
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) FAN-LESS CHILLER-LESS LIQUID-AIR COOLING FOR ELECTRONIC RACKS OF IT COMPONENTS IN DATA CENTERS
(FR) REFROIDISSEMENT LIQUIDE-AIR SANS VENTILATEURS NI REFROIDISSEURS POUR BÂTIS ÉLECTRONIQUES DE COMPOSANTS DE TI DANS DES CENTRES DE DONNÉES
Abstract
(EN) A data center cooling system includes a housing to contain electronic racks of IT components operating therein, a coolant distribution unit (CDU) situated within the housing to control a liquid flow of a cooling liquid. One or more liquid cooling devices are disposed on the IT components to receive a first liquid from the CDU, to exchange or extract heat generated from the IT components, to transform the first liquid to a second liquid with a higher temperature, and to transmit the second liquid back to the CDU. The CDU is coupled to a heat transfer system to dissipate the exchanged heat to an external environment. The data center cooling system includes an airflow delivery system to generate a direct or indirect airflow to travel through the servers of the electronic racks to remove heat generated by the servers to the external environment eliminating chiller and IT fans.
(FR) L’invention concerne un système de refroidissement de centre de données qui inclut un logement pour contenir des bâtis électroniques dans lesquels fonctionnent des composants de TI, une unité de distribution de réfrigérant (CDU) située à l’intérieur du logement pour contrôler l’écoulement liquide d’un liquide de refroidissement. Un ou plusieurs dispositifs de refroidissement liquide sont disposés sur les composants de TI pour recevoir un premier liquide de la CDU, pour échanger ou extraire la chaleur générée par les composants de TI, pour transformer le premier liquide en un deuxième liquide dont la température est supérieure, et pour retransmettre le deuxième liquide à la CDU. La CDU est couplée à un système de transfert de chaleur pour dissiper la chaleur échangée dans un environnement externe. Le système de refroidissement de centre de données inclut un système d’apport de flux d’air pour générer un flux d’air direct ou indirect qui traverse les serveurs des bâtis électroniques pour retirer la chaleur générée par les serveurs vers l’environnement externe éliminant les refroidisseurs et ventilateurs de TI.
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