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1. (WO2018200609) SYSTEMS AND METHODS FOR IMPROVED DELAMINATION CHARACTERISTICS IN A SEMICONDUCTOR PACKAGE

Pub. No.:    WO/2018/200609    International Application No.:    PCT/US2018/029259
Publication Date: Fri Nov 02 00:59:59 CET 2018 International Filing Date: Thu Apr 26 01:59:59 CEST 2018
IPC: H01L 21/58
H01L 21/67
Applicants: MICROCHIP TECHNOLOGY INCORPORATED
Inventors: LAEVOHAN, Taweesak
REYES, Philbert
VILAIRAT, Jaggrit
THANAISAWN, Sutee
PHIMPHUANG, Janpen
CHUNPANGAM, Somsak
Title: SYSTEMS AND METHODS FOR IMPROVED DELAMINATION CHARACTERISTICS IN A SEMICONDUCTOR PACKAGE
Abstract:
Systems and methods are provided for producing an integrated circuit package, e.g., an SOIC package, having reduced or eliminated lead delamination caused by epoxy outgassing resulting from the die attach process in which an integrated circuit die is attached to a lead frame by an epoxy. The epoxy outgassing may be reduced by heating the epoxy during or otherwise in association with the die attach process, e.g. using a heating device provided at the die attach unit. Heating the epoxy may achieve additional cross-linking in the epoxy reaction, which may thereby reduce outgassing from the epoxy, which may in turn reduce or eliminate subsequent lead delamination. A heating device located at or near the die attach site may be used to heat the epoxy to a temperature of 55 °C ± 5 °C during or otherwise in association with the die attach process.