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1. (WO2018200394) CONFIGURABLE HIGH TEMPERATURE CHUCK FOR USE IN A SEMICONDUCTOR WAFER PROCESSING SYSTEM

Pub. No.:    WO/2018/200394    International Application No.:    PCT/US2018/028901
Publication Date: Fri Nov 02 00:59:59 CET 2018 International Filing Date: Tue Apr 24 01:59:59 CEST 2018
IPC: H01L 21/67
H01L 21/673
H01L 21/683
H01L 21/687
B05C 13/02
C23C 14/50
Applicants: VEECO PRECISION SURFACE PROCESSING LLC
Inventors: BREINGAN, William, Gilbert
HOFMEISTER, Chris
TADDEI, John
Title: CONFIGURABLE HIGH TEMPERATURE CHUCK FOR USE IN A SEMICONDUCTOR WAFER PROCESSING SYSTEM
Abstract:
A reconfigurable wafer spin chuck for supporting a wafer includes a rotatable chuck base having a first opening formed therein and including one or more support members extending upwardly therefrom. The spin chuck is reconfigurable between a first chuck type and a second chuck type, wherein the first chuck type comprises a non-contact wafer type chuck and the second chuck type comprises an open backside frame type chuck. In the non- contact wafer type chuck, a first insert is mounted to the chuck base and supported by the one or more support members and in the open backside frame type chuck, a second insert is mounted to the chuck base and supported by the one or more support members. The wafer is spaced a first distance from the first insert and is spaced a second distance from the second insert, the second distance being greater than the first distance.