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1. (WO2018200304) ULTRASOUND PROBE WITH THIN FILM FLEX CIRCUIT AND METHODS OF PROVIDING SAME

Pub. No.:    WO/2018/200304    International Application No.:    PCT/US2018/028334
Publication Date: Fri Nov 02 00:59:59 CET 2018 International Filing Date: Fri Apr 20 01:59:59 CEST 2018
IPC: B06B 1/02
B06B 1/06
Applicants: GENERAL ELECTRIC COMPANY
Inventors: BRUESTLE, Reinhold
RITTENSCHOBER, Thomas
SCHOENAUER, Manuel
KREMSL, Andreas
SCHRÖDER, Rainer
Title: ULTRASOUND PROBE WITH THIN FILM FLEX CIRCUIT AND METHODS OF PROVIDING SAME
Abstract:
An ultrasound probe and method of forming an ultrasound probe are provided. The ultrasound probe comprises a two-dimensional (2D) transducer assembly having transducer elements arranged in rows and columns. The transducer elements have front and rear surfaces. The front surface is configured to transmit and receive ultrasound signals to and from an object of interest. A thin film flex circuit extends along the rear surface of the transducer assembly. The flex circuit has conductive traces arranged in layers and enclosed within a common dielectric layer. The dielectric layer has a homogeneous composition surrounding the layers of the conductive traces. The conductive traces are electrically interconnected to the corresponding transducer elements.