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1. (WO2018200059) WAFER SCALE BONDED ACTIVE PHOTONICS INTERPOSER

Pub. No.:    WO/2018/200059    International Application No.:    PCT/US2018/017558
Publication Date: Fri Nov 02 00:59:59 CET 2018 International Filing Date: Sat Feb 10 00:59:59 CET 2018
IPC: G02B 6/12
H01L 21/18
G02B 6/42
G02B 6/122
G02B 6/13
G02B 6/132
G02B 6/134
G02B 6/136
H01L 23/498
H01L 21/762
H01L 27/12
Applicants: THE RESEARCH FOUNDATION FOR THE STATE UNIVERSITY OF NEW YORK
Inventors: COOLBAUGH, Douglas
LA TULIPE, JR., Douglas
LEAKE, Gerald
Title: WAFER SCALE BONDED ACTIVE PHOTONICS INTERPOSER
Abstract:
There is set forth herein a method including building an interposer base structure on a first wafer having a first substrate, wherein the building an interposer base structure includes fabricating a plurality of through vias that extend through the first substrate and fabricating within an interposer base dielectric stack formed on the first substrate one or more metallization layer; building a photonics structure on a second wafer having a second substrate, wherein the building a photonics structure includes fabricating within a photonics device dielectric stack formed on the second substrate one or more photonics device; and bonding the photonics structure to the interposer base structure to define an interposer having the interposer base structure and one or more photonics device fabricated within the photonics device dielectric stack.