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|1. (WO2018200059) WAFER SCALE BONDED ACTIVE PHOTONICS INTERPOSER|
|Applicants:||THE RESEARCH FOUNDATION FOR THE STATE UNIVERSITY OF NEW YORK
LA TULIPE, JR., Douglas
|Title:||WAFER SCALE BONDED ACTIVE PHOTONICS INTERPOSER|
There is set forth herein a method including building an interposer base structure on a first wafer having a first substrate, wherein the building an interposer base structure includes fabricating a plurality of through vias that extend through the first substrate and fabricating within an interposer base dielectric stack formed on the first substrate one or more metallization layer; building a photonics structure on a second wafer having a second substrate, wherein the building a photonics structure includes fabricating within a photonics device dielectric stack formed on the second substrate one or more photonics device; and bonding the photonics structure to the interposer base structure to define an interposer having the interposer base structure and one or more photonics device fabricated within the photonics device dielectric stack.