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1. (WO2018200028) SEMICONDUCTOR WIRE BONDING MACHINE CLEANING DEVICE AND METHOD

Pub. No.:    WO/2018/200028    International Application No.:    PCT/US2017/058829
Publication Date: Fri Nov 02 00:59:59 CET 2018 International Filing Date: Sat Oct 28 01:59:59 CEST 2017
IPC: H01L 23/00
B23K 20/00
B23K 20/26
Applicants: INTERNATIONAL TEST SOLUTIONS, INC.
Inventors: HUMPHREY, Alan, E.
SMITH, Wayne, C.
SHIVLAL, Janakraj
HUMPHREY, Bret, A.
Title: SEMICONDUCTOR WIRE BONDING MACHINE CLEANING DEVICE AND METHOD
Abstract:
A methodology and medium for regular and predictable cleaning the support hardware such as capillary tube in semiconductor assembly equipment components, while it is still in manual, semi-automated, and automated assembly are disclosed. The cleaning material may include a cleaning pad layer and one or more intermediate layers that have predetermined characteristics.