Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2018199706) ENCAPSULATION MATERIAL COMPOSITION
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/199706 International Application No.: PCT/KR2018/004985
Publication Date: 01.11.2018 International Filing Date: 30.04.2018
IPC:
H01L 51/52 (2006.01) ,C08J 3/24 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52
Details of devices
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
3
Processes of treating or compounding macromolecular substances
24
Crosslinking, e.g. vulcanising, of macromolecules
Applicants:
주식회사 엘지화학 LG CHEM, LTD. [KR/KR]; 서울시 영등포구 여의대로 128 128, Yeoui-daero, Yeongdeungpo-gu, Seoul 07336, KR
Inventors:
최국현 CHOI, Kook Hyun; KR
김준형 KIM, Joon Hyung; KR
우유진 WOO, Yu Jin; KR
유미림 YU, Mi Lim; KR
Agent:
특허법인 다나 DANA PATENT LAW FIRM; 서울시 강남구 역삼로 3길 11 광성빌딩 신관 5층 5th Floor, New Wing, Gwangsung Bldg., 11, Yeoksam-ro 3-gil, Gangnam-gu, Seoul 06242, KR
Priority Data:
10-2017-005507528.04.2017KR
Title (EN) ENCAPSULATION MATERIAL COMPOSITION
(FR) COMPOSITION DE MATÉRIAU D’ENCAPSULATION
(KO) 밀봉재 조성물
Abstract:
(EN) The present application relates to an encapsulation material composition, a method for manufacturing the encapsulation material composition, and an organic electronic device including the same, and provides an encapsulation material composition which effectively blocks moisture or oxygen introduced into the organic electronic device from the outside and thus can secure a lifespan of the organic electronic device, and a method for manufacturing the same.
(FR) La présente invention concerne une composition de matériau d’encapsulation, un procédé de fabrication de la composition de matériau d’encapsulation, et un dispositif électronique organique comprenant celle-ci, et fournit une composition de matériau d’encapsulation qui bloque efficacement l’humidité ou l’oxygène introduits dans le dispositif électronique organique depuis l’extérieur et peut ainsi assurer une durée de vie du dispositif électronique organique, et son procédé de fabrication.
(KO) 본 출원은 밀봉재 조성물, 밀봉재 조성물의 제조 방법 및 이를 포함하는 유기전자장치에 관한 것으로서, 외부로부터 유기전자장치로 유입되는 수분 또는 산소를 효과적으로 차단하여 유기전자장치의 수명을 확보할 수 있는 밀봉재 조성물 및 이의 제조 방법을 제공한다.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)