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1. (WO2018199394) GOLD-DEPOSITED COPPER FILM AND MANUFACTURING METHOD THEREFOR

Pub. No.:    WO/2018/199394    International Application No.:    PCT/KR2017/008309
Publication Date: Fri Nov 02 00:59:59 CET 2018 International Filing Date: Wed Aug 02 01:59:59 CEST 2017
IPC: C23C 14/16
C23C 14/56
B23K 1/00
B23K 101/42
Applicants: JIN YOUNG R&S CO., LTD
주식회사 진영알앤에스
Inventors: KWON, Hyeok Jeon
권혁전
LEE, Sang Mok
이상목
Title: GOLD-DEPOSITED COPPER FILM AND MANUFACTURING METHOD THEREFOR
Abstract:
The present invention relates to a gold-deposited copper film. The gold-deposited copper film comprises: a metal layer composed of copper; a metal barrier layer positioned on the metal layer and including brass, manganese brass, phosphor bronze, silzin, delta metal, naval brass, aluminum (Al)-brass alloy, copper (Cu)-tin (Sn) alloy, and bronze or copper (Cu)-lead (Pb) alloy; and a gold layer positioned on the metal barrier layer.