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1. (WO2018199345) DIE DEVICE FOR PIERCING PROCESS
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Pub. No.: WO/2018/199345 International Application No.: PCT/KR2017/004369
Publication Date: 01.11.2018 International Filing Date: 25.04.2017
IPC:
B21D 31/02 (2006.01) ,B21D 37/10 (2006.01) ,B21D 45/02 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
21
MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
D
WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING
31
Other methods for working sheet metal, metal tubes, metal profiles
02
Stabbing or piercing, e.g. for making sieves
B PERFORMING OPERATIONS; TRANSPORTING
21
MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
D
WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING
37
Tools as parts of machines covered by this subclass
10
Die sets; Pillar guides
B PERFORMING OPERATIONS; TRANSPORTING
21
MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
D
WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING
45
Ejecting or stripping-off devices arranged in machines or tools dealt with in this subclass
02
Ejecting devices
Applicants:
주식회사 에이취케이 H.K CO., LTD. [KR/KR]; 광주시 광산구 소촌로123번길 14-19 14-19, Sochon-ro 123beon-gil Gwangsan-gu Gwangju 62384, KR
Inventors:
이경록 LEE, Kyung Rok; KR
Agent:
특허법인 아주 AJU INTERNATIONAL LAW & PATENT GROUP; 서울시 서초구 사임당로 174, 강남미래타워 12-13층 12-13th Floor, Gangnam Mirae Tower, 174 Saimdang- Ro Seocho-gu Seoul 06627, KR
Priority Data:
10-2017-005257724.04.2017KR
Title (EN) DIE DEVICE FOR PIERCING PROCESS
(FR) DISPOSITIF DE TYPE MATRICE POUR PROCÉDÉ DE PERÇAGE
(KO) 피어싱 가공용 금형장치
Abstract:
(EN) The present invention relates to a die device for a piercing process, the die device comprising: a lower die part on which a material is seated; an upper die part which is disposed over the lower die part, is vertically moved, and forms a piercing hole through the material; a guide part which is disposed under the lower die part and guides a scrap generated at the time of material processing; and an air injection part for injecting air to the guide part to move the scrap. Therefore, the device can quickly discharge a scrap.
(FR) La présente invention concerne un dispositif de type matrice pour un procédé de perçage, le dispositif de type matrice comprenant : une partie matrice inférieure sur laquelle un matériau est placé ; une partie matrice supérieure qui est disposée sur la partie matrice inférieure, est déplacée verticalement, et forme un trou de perçage à travers le matériau ; une partie de guidage qui est disposée sous la partie matrice inférieure et guide les déchets générés lors du traitement du matériau ; et une partie d'injection d'air pour injecter de l'air dans la partie de guidage pour déplacer les déchets. Par conséquent, le dispositif peut rapidement évacuer des déchets.
(KO) 본 발명은 피어싱 가공용 금형장치에 관한 것으로, 소재가 안착되는 하부금형부와, 하부금형부의 상방에 배치되고 상하 이동되면서 소재에 피어싱 홀을 가공하는 상부금형부와, 하부금형부의 하방에 배치되고 소재 가공시 발생하는 스크랩을 안내하는 가이드부와, 가이드부에 공기를 분사하여 스크랩을 이동시키는 공기분사부를 포함하여, 스크랩을 신속하게 배출할 수 있다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)