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1. (WO2018199309) SEALING FILM AND SEALED STRUCTURE, AND METHOD FOR MANUFACTURING SEALING FILM AND SEALED STRUCTURE
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Pub. No.: WO/2018/199309 International Application No.: PCT/JP2018/017268
Publication Date: 01.11.2018 International Filing Date: 27.04.2018
IPC:
C08J 5/18 (2006.01) ,B29C 43/34 (2006.01) ,C08K 3/00 (2018.01) ,C08L 63/00 (2006.01) ,C08L 101/00 (2006.01) ,H01L 21/56 (2006.01) ,H01L 23/29 (2006.01) ,H01L 23/31 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
18
Manufacture of films or sheets
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
43
Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
32
Component parts, details or accessories; Auxiliary operations
34
Feeding the material to the mould or the compression means
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101
Compositions of unspecified macromolecular compounds
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56
Encapsulations, e.g. encapsulating layers, coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
29
characterised by the material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
31
characterised by the arrangement
Applicants:
日立化成株式会社 HITACHI CHEMICAL COMPANY, LTD. [JP/JP]; 東京都千代田区丸の内一丁目9番2号 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606, JP
Inventors:
渡瀬 裕介 WATASE Yusuke; JP
野村 豊 NOMURA Yutaka; JP
石毛 紘之 ISHIGE Hiroyuki; JP
鈴木 雅彦 SUZUKI Masahiko; JP
Agent:
長谷川 芳樹 HASEGAWA Yoshiki; JP
清水 義憲 SHIMIZU Yoshinori; JP
平野 裕之 HIRANO Hiroyuki; JP
Priority Data:
2017-09035628.04.2017JP
Title (EN) SEALING FILM AND SEALED STRUCTURE, AND METHOD FOR MANUFACTURING SEALING FILM AND SEALED STRUCTURE
(FR) FILM D’ÉTANCHÉITÉ ET STRUCTURE ÉTANCHE, ET PROCÉDÉ DE FABRICATION DU FILM D’ÉTANCHÉITÉ ET DE LA STRUCTURE ÉTANCHE
(JA) 封止用フィルム及び封止構造体、並びにこれらの製造方法
Abstract:
(EN) Provided is a method for manufacturing a sealing film containing a heat curable resin, and an inorganic filler, the method comprising: the step for preparing a resin composition containing a resin having a reactive functional group equivalent of 250 g/mol or larger as the heat curable resin, and the inorganic filler; and the step for shaping the resin composition into a film.
(FR) La présente invention concerne un procédé de fabrication d’un film d’étanchéité contenant une résine thermodurcissable et une charge inorganique, le procédé comprenant : l’étape de préparation d’une composition de résine contenant une résine ayant un groupe fonctionnel réactif équivalent à 250 g/mole ou plus, en guise de résine thermodurcissable, et la charge inorganique ; et l’étape de mise en forme de la composition de résine en un film.
(JA) 熱硬化性樹脂と、無機充填材と、を含有する封止用フィルムの製造方法であって、熱硬化性樹脂として反応性官能基当量が250g/molより大きい樹脂と、前記無機充填材と、を含有する樹脂組成物を準備する工程と、樹脂組成物をフィルム状に成形する工程と、を備える、封止用フィルムの製造方法。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)